Electron. Mater. Device Res. Center, Korea Electron. Technol. Inst., Seongnam, South Korea;
aluminium compounds; heat conduction; laminates; resins; thermal conductivity; thermal insulating materials; thermal insulation; AlN; bimodal fillers; biphenyl structure; curing agent; high peel strength; high thermal conductivity; sintered spherical powders; size 10 mum; size 50 mum; spherical aluminum nitride powders; synthesized epoxy resin; synthesized twin mesogenic epoxy oligomer; thermally conducting insulation laminates; thermally conducting laminate; trimodal fillers; Conductivity; Heating; III-V semiconductor;
机译:硼酸铝粉的碳热还原和氮化对氮化铝/氮化硼纳米复合材料的制备与表征
机译:具有改进的机械和导热性能的β-环糊精交联环氧聚丁二烯/羟基化硼氮化物纳米复合材料的制备
机译:中空球形氮化硼粉末的制备与表征
机译:使用球形氮化铝粉末和合成双介质脱氧环氧低聚物的热传导层压材料的制造与表征
机译:环氧树脂中氮化铝粉末的高固体含量:分散性和导热性。
机译:从铝粉生产氮化铝粉的两阶段等离子体热氮化工艺
机译:填充颗粒状氮化铝粉的环氧树脂的导热系数