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Silicon integrated dielectric resonator antenna solution for 60GHz front-end modules

机译:用于60GHz前端模块的硅集成电介质谐振器天线解决方案

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A new dielectric resonator antenna (DRA) solution for the complete integration of radio front end at 60GHz is presented. The solution is a SoC configuration consisting of an integrated PA and a CPW fed slot on 65nm CMOS SOI (Silicon on Insulator) technology from ST Microelectronics. A co-design strategy is taken into consideration to reduce the size of the system and matching circuit losses. A total size of 1mm2 die has been achieved for both PA and Antenna excitation element. The antenna element as a whole is then taken from this SoC solution into a SiP configuration which can integrate the DR and silicon based elements, achieving a high gain (5dBi) and a bandwidth of 5GHz in the specified band.
机译:提出了一种新的介电共振器天线(DRA)解决方案,该解决方案可以完全集成60 GHz的无线电前端。该解决方案是SoC配置,其中包括集成的PA和ST Microelectronics的65nm CMOS SOI(绝缘体上硅)技术上的CPW馈电插槽。考虑采用共同设计策略以减小系统尺寸并匹配电路损耗。 PA和天线激励元件的总尺寸为1mm 2 芯片。然后,将整个天线元件从该SoC解决方案中带入SiP配置,该配置可以集成基于DR和基于硅的元件,从而在指定频段内实现高增益(5dBi)和5GHz带宽。

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