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Er-doped high-index materials for compact, on-chip devices

机译:掺高折射率材料,用于紧凑的片上器件

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摘要

Er-doping of high-index materials for compact on-chip optical devices are investigated. Two sets of materials, SiNx and ErxY2−xSiO5, are used as high-index host materials. We find that in the case of ErxY2−xSiO5, crystallization-induced surface roughness can limit the optical activation of Er and cause significant propagation loss, while in the case of SiNx, very high temperatures can be used without clustering or optical de-activation of Er. In both cases, cooperative upconversion limits the amount of Er that can be doped, with SiNx providing the lower cooperative upconversion coefficient.
机译:研究了用于紧凑型片上光学器件的高折射率材料的Er掺杂。两组材料SiNx和ErxY2-xSiO5用作高折射率基质材料。我们发现,在ErxY2-xSiO5的情况下,结晶引起的表面粗糙度会限制Er的光学活化并导致显着的传播损耗,而在SiNx的情况下,可以使用非常高的温度而不会发生团簇或光学失活呃。在这两种情况下,协同上转换都会限制可以掺杂的Er量,而SiNx会提供较低的协同上转换系数。

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