Thermal Constraints for BBL Placement

摘要

The trends in microelectronic design go toward increased component integrated density and higher power consumed. The thermal management has been a more prominent role in recent year. Therefore, an accurate thermal model was needed to develop a new placement algorithm designed to consider both minimizing chip's area and making thermal evenly. The simulated annealing was employed in our algorithm. The experimental results show that the thermal distributed evenly and the temperature of the 'hot spots' decreased greatly in the chip.