In situ Monitoring of the Dimensional Changes and Mechanisms During Solvent Debinding

摘要

Binder removal is an important step in the powder injection molding (PIM) process. During debinding, thermal expansion, polymer swelling, and binder extraction cause dimensional changes that may affect final component dimensions. Dimensional changes during solvent debinding have not been studied extensively because, in the past, it was difficult to measure samples during debinding without contacting them and disrupting the accuracy of the observations. In an effort to overcome this problem, a non-invasive laser dilatometer was designed for precise in situ monitoring of the dimensional changes of components during the solvent debinding stage of the PIM process. Through utilization of the laser dilatometer, as well as debinding rate observations, an extensive analysis of the solvent debinding proce has been developed and new insight into the significant mechanisms has been made.