The removal of a binder phase via thermal debinding is a process step inherent to all powder injection molding (PIM) processes. Binder volatilization and removal can be influenced by processing in sub-ambient pressures. Temperature and pressure profiles can be combined to optimize the debinding behavior. Understanding the response of different polymer systems to sub-ambient processing conditions allows the evaluation of suitable binder components for a desired debinding behavior. This study examines the effect of partial pressure processing on the debinding rate behavior of PIM components as measured by TGA. Several polymer systems are examined to illustrate the spectrum of possible response behaviors.
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