Microwave and Millimeterwave Transceivers for Radio Links and LMDS Communications - The Challenge for Technology and Packaging Strategy

摘要

The overall growing demand for Millimeterwave Modules in Digital Radio applications like LMDS (Local Multipoint Distribution System) or LMCS (Local Multipoint Communication System) or MVDS (Microwave Video Distribution System) and related technologies are main part of the business mission in our Competence Center "Micro- and Millimeterwave Technologies" of EADS Deutschland GmbH (European Aeronautic Defence and Space Company). Based on a long term experience of modern active phased array radars and in different application fields, like ground based, naval and airborne, the communication module market is still a big challenge for high volume production in our Microwave Factory. Actually we work on focal points with Point-to-Point radios at 23, 26, 38 and 58 GHz and the Point-to- Multipoint radios with spectrum allocations at 28 and 42 GHz. Advanced substrate technologies, based on FR4 multilayers combined with teflon materials and the use of single packaged RF-MMICs with BGA (Ball Grid Array) will be compared with traditional module architectures based on the use of thin film ceramics and Chip&Wire technologies. Results and experience of a 38 GHz radio module with a MCM-C (Multichip Module, based on ceramics) in LTCC (Low Temperature Cofired Ceramic) technology will be discussed. Our technology strategy and packaging roadmap is mainly driven by long-term reliability, availability of basic materials and components and modularity. The trends of new module architectures and packaging technologies with GaAs chips in "Hot-Via" technology will be shown, as well as the idea of a Box-of- Bricks for a standard mm-wave transceiver radio.