首页> 外文会议>The 2001 ASME International Mechanical Engineering Congress and Exposition, 2001, Nov 11-16, 2001, New York, New York >A NATURAL CIRCULATION MODEL OF THE CLOSED LOOP, TWO-PHASE THERMOSYPHON FOR ELECTRONICS COOLING
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A NATURAL CIRCULATION MODEL OF THE CLOSED LOOP, TWO-PHASE THERMOSYPHON FOR ELECTRONICS COOLING

机译:闭环两相热电偶电子冷却的自然循环模型

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The study presents a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. Most available models deal with two-phase thermosyphons with counter-current circulation within a closed, vertical, wickless heat pipe. The present research focuses on CLTPTs for electronics cooling that face more complex two-phase flow patterns than the vertical heat pipes, due to closed loop geometry and smaller tube size. The present model is based on mass, momentum, and energy balances in the evaporator, rising tube, condenser, and the falling tube. The homogeneous two-phase flow model is used to evaluate the friction pressure drop of the two-phase flow imposed by the available gravitational head through the loop. The saturation temperature dictates both the chip temperature and the condenser heat rejection capacity. Thermodynamic constraints are applied to model the saturation temperature, which also depends upon the local heat transfer coefficient and the two-phase flow patterns inside the condenser. The boiling characteristics of the enhanced structure are used to predict the chip temperature. The model is compared with experimental data for dielectric working fluid PF-5060 and is in general agreement with the observed trends. The degradation of condensation heat transfer coefficient due to diminished vapor convective effects, and the presence of subcooled liquid in the condenser are expected to cause higher thermal resistance at low heat fluxes. The local condensation heat transfer coefficient is a major area of uncertainty.
机译:该研究提出了一种在闭环两相热虹吸管(CLTPT)中进行并流自然循环的两相流动和传热模型。大多数可用的模型都处理封闭的垂直无芯热管中具有逆流循环的两相热虹吸管。由于封闭回路的几何形状和较小的管径,本研究的重点是用于电子冷却的CLTPT,​​与垂直热管相比,它们面临着更复杂的两相流模式。本模型基于蒸发器,上升管,冷凝器和下降管中的质量,动量和能量平衡。均质两相流模型用于评估可用重力头通过回路施加的两相流的摩擦压降。饱和温度决定了芯片温度和冷凝器的散热能力。应用热力学约束来模拟饱和温度,该温度还取决于局部传热系数和冷凝器内部的两相流型。增强结构的沸腾特性用于预测切屑温度。该模型与电介质工作流体PF-5060的实验数据进行了比较,并且与观察到的趋势基本吻合。由于蒸汽对流作用的减弱,冷凝传热系数的降低,以及冷凝器中过冷液体的存在,有望在低热通量下产生更高的热阻。局部冷凝传热系数是不确定性的主要领域。

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