首页> 外文会议>1997 6th International Symposium on Recent Advances in Microwave Technology Proceedings >Sandwich Envelope Model of Microwave Power Amplifier and its Application in Intermodulation Simulation
【24h】

Sandwich Envelope Model of Microwave Power Amplifier and its Application in Intermodulation Simulation

机译:微波功率放大器的夹心包络模型及其在互调仿真中的应用

获取原文
获取原文并翻译 | 示例

摘要

The paper presents a frequency-dependent nonlinear envelope model, Sandwich Envelope Model, which can be easily used in the multiptone intermodulation simulation of microwave power amplifier in communication systems. The identification algorithm of the model's Volterra kernels is also thoroughly discussed. Since the model includes the memory functions of input and output match networks, it is inherently more accurate than the memory-less nonlinear envelope model in broad-band system simulation. Further more, the employment of envelope model makes it more efficient in simulation comparing with the normal Sandwich Instantaneous Model.
机译:本文提出了一种与频率有关的非线性包络模型,Sandwich Envelope模型,可以轻松地用于通信系统中微波功率放大器的多调互调仿真。还彻底讨论了模型的Volterra内核的识别算法。由于该模型包括输入和输出匹配网络的存储功能,因此与宽带系统仿真中的无存储器非线性包络模型相比,它固有地更准确。此外,采用包络模型比常规的三明治瞬时模型更有效地进行仿真。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号