Advances in Tantalum Capacitor Manufacturing Technology that will enable the Continued Miniaturisation of Electronic Product Designs

摘要

Using the conventional manufacturing methods for Tantalum capacitor assembly, it becomes increasingly difficult to achieve a finished product with useful volumetric efficiency as the case size & package height reduces. Recent developments in manufacturing techniques have enabled smaller & thinner component geometry's to be realised. This paper will present an explanation of manufacturing methodology & details of the new capacitor case sizes & constructions possible. It will also explore the future potential for capacitors in the microFarad to milliFarad range in packages where height/thickness is less than 1.5mm.