首页> 外文会议>10th EMAS regional workshop on electron probe microanalysis of materials today : Practical aspects >COMPARISON OF EBSD AND SLEEM IN ULTRA FINEGRAINED MATERIALS CHARACTERISATION
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COMPARISON OF EBSD AND SLEEM IN ULTRA FINEGRAINED MATERIALS CHARACTERISATION

机译:超细化材料表征中EBSD和SLEEM的比较

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摘要

The information contained in scanning low-energy electron microscopy (SLEEM) images and electron backscatter diffraction (EBSD) maps both stem from orientation dependence of contrast, in the first case, and of diffraction pattern appearance in the latter one. Both tools seem to be suitable for measuring the grain size distribution in ultra fine-grained (UFG) materials, especially when the grain refinement is achieved by severe plastic deformation, which is known to leave the microstructure inhomogeneous in terms of grain size. Since the grain size distribution in UFG materials spans over a few orders of magnitude, it is somewhat difficult to set appropriate step size and dimensions of an EBSD scan to fully characterize the microstructure in a reasonable time. An advantage of SLEEM over EBSD in this case should be the possibility to capture single high-resolution image of a large area, containing both the small and large grains, providing sufficient contrast and ability to be analyzed by conventional image analysis tools. A comparison was made between grain size distribution measurements based on SLEEM images and on EBSD data. The material under investigation was 99.9 % pure copper, processed by equal channel angular pressing (ECAP) method, following the processing route "Bc" in eight steps. The plane of observation was oriented so as to intersect the plane of shear during the last ECAP pass. SLEEM image data were acquired using two different kinds of instrument: one with conventional (high) vacuum system and another capable of ultra-high vacuum operation (UHV), both equipped with cathode lens to decelerate the primary beam. The system used to acquire EBSD data was a thermal emission type SEM with high vacuum system. The results showed that UHV SLEEM is superior to the high vacuum one in achieving better orientation contrast, but the particular UHV instrument suffered from image distortion at wider fields of view, therefore, image stitching would be necessary to cover the same area at the cost of time and inaccuracies at stitches. Based on our experience with long term stability of the particular EBSD system, the time of EBSD scan needed to be 4 hours at longest to avoid excessive drift and beam intensity decay. This limitation dictated the largest field of view of the EBSD map of 30 × 40 μm, resulting in upper equivalent grain diameter limit of approx. 7 μm, when discarding the edge grains. The grain size distributions resulting from image analysis of series of separate SLEEM pictures plotted as area fraction versus equivalent grain diameter were in a good agreement within the dimensional scale covered by both instruments. Grain size distributions calculated from EBSD data agreed with those from SLEEM images when the "grain tolerance angle" parameter was set to 5°.
机译:扫描低能电子显微镜(SLEEM)图像和电子背散射衍射(EBSD)映射中包含的信息均来自第一种情况下对比度的方向依赖性,以及后一种情况下的衍射图样外观。两种工具似乎都适合测量超细晶粒(UFG)材料的晶粒尺寸分布,特别是当通过严重的塑性变形实现晶粒细化时,众所周知,塑性变形会导致晶粒尺寸不均匀的微观结构。由于UFG材料中的晶粒尺寸分布跨越几个数量级,因此很难设置适当的步长和EBSD扫描尺寸以在合理的时间内充分表征微观结构。在这种情况下,SLEEM优于EBSD的优点是可以捕获包含小颗粒和大颗粒的大区域的单个高分辨率图像,从而提供足够的对比度和能力,可以通过常规图像分析工具进行分析。在基于SLEEM图像和EBSD数据的晶粒尺寸分布测量之间进行了比较。所研究的材料是99.9%的纯铜,采用等通道转角挤压(ECAP)方法,按照“ Bc”的加工路线分八个步骤进行加工。将观察平面定向为与最后一次ECAP通过时的剪切平面相交。 SLEEM图像数据是使用两种不同的仪器获取的:一种具有常规(高)真空系统,另一种具有超高真空操作(UHV),均配备了阴极透镜以使主光束减速​​。用于获取EBSD数据的系统是具有高真空系统的热发射型SEM。结果表明,UHV SLEEM在获得更好的方向对比度方面优于高真空SLEEM,但是特定的UHV仪器在较宽的视野下会出现图像失真,因此,需要进行图像拼接才能覆盖相同的区域,但代价是时间和针迹不准确。根据我们对特定EBSD系统的长期稳定性的经验,EBSD扫描时间最长需要为4小时,以避免过度漂移和光束强度衰减。该限制规定EBSD图的最大视场为30×40μm,导致等效晶粒直径上限大约为30μm。丢弃边缘颗粒时为7μm。由一系列分离的SLEEM图片的图像分析得出的晶粒尺寸分布,以面积分数与等效晶粒直径的关系绘制,在两种仪器所涵盖的尺寸范围内,都具有良好的一致性。当“晶粒公差角”参数设置为5°时,从EBSD数据计算得到的晶粒尺寸分布与从SLEEM图像获得的晶粒尺寸分布一致。

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  • 会议地点 Padua(IT)
  • 作者单位

    Brno University of Technology, Faculty of Mechanical Engineering, Institute of Materials Science and Engineering Technickd 2896/2, CZ-61669 Brno, Czech Republic Academy of Sciences of the Czech Republic, Institute of Scientific Instruments Brno, Czech Republic;

    Brno University of Technology, Faculty of Mechanical Engineering, Institute of Materials Science and Engineering Technickd 2896/2, CZ-61669 Brno, Czech Republic Academy of Sciences of the Czech Republic, Institute of Scientific Instruments Brno, Czech Republic;

    Brno University of Technology, Faculty of Mechanical Engineering, Institute of Materials Science and Engineering Technickd 2896/2, CZ-61669 Brno, Czech Republic Academy of Sciences of the Czech Republic, Institute of Scientific Instruments Brno, Czech Republic;

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