SEMICONDUCTOR-ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION WHICH IS NOT DECOMPOSED OR SEPARATED AFTER HUNDREDS OF TEMPERATURE CYCLES AT 65-150 amp;deg;C, AND IS NOT DETERIORATED IN CONDITION OF HIGH TEMPERATURE AND HIGH HUMIDITY, AND A SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A semiconductor-encapsulating liquid epoxy resin composition is provided to have low viscosity, excellent permeability, and to provide excellent adhesion and high rigidity after curing to a photosensitive polyimide resin and a nitride membrane.;CONSTITUTION: A semiconductor-encapsulating liquid epoxy resin composition comprises: a liquid epoxy resin, an aromatic amine curing agent in which molar ratio of total amino groups to the total epoxy groups is 0.7-1.2; and inorganic filler comprising inorganic filler A with an average particle size of 0.1-3 micron, and inorganic filler B which is amorphous nanosilica having a surface treated by a coupling agent in chemical formula 1 and/or chemical formula 2. In the chemical formulas, n is an integer from 1-5, and m is 1 or 2.;COPYRIGHT KIPO 2012