SEMICONDUCTOR-ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

A semiconductor-encapsulating liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an aromatic amine curing agent, and (C) an inorganic filler comprising an inorganic filler A which is a silica having an average particle size of 0.1 to 3 μm, and an inorganic filler B which is an amorphous nanosilica having an average particle size of 5 to 70 nm and having its surface treated with a coupling agent represented by the following formula (1) and/or (2):; ;wherein n is an integer of 1 to 5, and m is 1 or 2.