首页> 外文期刊>Journal of Ceramic Processing Research. (Text in English) >Deterioration of mechanical properties by the curing of phenolic resin during fabrication of porous PSZ ceramics under high temperatures and high humidities
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Deterioration of mechanical properties by the curing of phenolic resin during fabrication of porous PSZ ceramics under high temperatures and high humidities

机译:在高温高湿条件下制造多孔PSZ陶瓷过程中酚醛树脂固化引起的机械性能下降

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摘要

Mechanical and microstructural analyses of partially stabilized zirconia (PSZ) ceramics maintained under high temperature and a high relative humidity were investigated to elucidate the relation between the curing of the phenolic resin as a binder and the deterioration of the ceramics. The PSZ powders containing the binder were exposed to the high humidity (85%, 50 °C) and the high temperature (25%, 100 °C) atmospheres for 1 h before compaction. The green densities of the specimens decreased from 3.54 g/cm3 to 3.45 g/cm~3 and to 3.35 g/cm~3, respectively. The flexural strengths decreased about 3% and 8% compared to the specimen exposed to a lower humidity and temperature condition (25%, 50 °C). Rough surfaces and some agglomerated particles with a large volume of voids and internal spaces, were observed in the fracture surfaces of the green bodies. These agglomerates were generated by the curing of the phenolic resin with the formation of methylene bridges. The reaction occurred by the decomposition of hexamine as a curing agent in the high temperature and the high humidity atmospheres.
机译:研究了在高温和高相对湿度下保持的部分稳定的氧化锆(PSZ)陶瓷的机械和微观结构分析,以阐明酚醛树脂作为粘合剂的固化与陶瓷劣化之间的关系。在压实之前,将包含粘合剂的PSZ粉末暴露于高湿度(85%,50°C)和高温(25%,100°C)气氛中1小时。样品的生坯密度分别从3.54 g / cm〜3降低到3.45 g / cm〜3和3.35 g / cm〜3。与暴露在较低湿度和温度条件下(25%,50°C)的样品相比,弯曲强度分别降低了约3%和8%。在生坯的断裂表面观察到粗糙的表面和一些带有大量空隙和内部空间的团聚颗粒。这些附聚物是通过酚醛树脂固化并形成亚甲基桥而生成的。该反应是由于在高温和高湿气氛下六胺作为固化剂的分解而发生的。

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