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The Stoichiometry of Electroless Silicon Etching in Solutions of V2O5 and HF

机译:V2O5和HF溶液中化学硅蚀刻的化学计量

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The etching of silicon is of fundamental importance in the manufacture of semiconductor devices, in the fabrication of microelectromechanical systems, and increasingly in materials chemistry. The wet-chemical etching of Si in HNO3/HF, an electroless electrochemical process, is an essential step in the manufacture of solar cells. When performed under conditions for the formation of porous silicon (por-Si), the process is known as stain etching. It can be initiated by a variety of more suitable oxidizing agents and can be used for the low-cost production of nanocrystalline por-Si powder or Si nanocrystals. Nonetheless, we still lack the most basic chemical understanding of this reaction: the reaction stoichiometry is unknown. Herein we conclusively report the reaction stoichiometry and interpret it fundamentally in terms of Marcus theory of electron transfer and the Gerischer model of Si etching.
机译:硅的蚀刻在半导体器件的制造,微机电系统的制造以及材料化学中越来越重要。在HNO3 / HF中对硅进行湿化学刻蚀是一种化学方法,是太阳能电池制造中必不可少的步骤。当在形成多孔硅(por-Si)的条件下执行时,该过程称为污点蚀刻。它可以由多种更合适的氧化剂引发,并且可以用于低成本生产纳米晶体por-Si粉末或Si纳米晶体。但是,我们仍然对该反应缺乏最基本的化学理解:化学计量是未知的。在此,我们总结性地报告反应化学计量,并从马库斯电子传输理论和Si蚀刻的Gerischer模型进行了根本性的解释。

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