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首页>中文会议>工业技术>自动化技术与计算机技术>2011传感器与MEMS技术产业化国际研讨会
2011传感器与MEMS技术产业化国际研讨会

2011传感器与MEMS技术产业化国际研讨会

  • 召开年：2011
  • 召开地：苏州
  • 出版时间： 2011-10-27

主办单位：中国材料研究学会;中国微米纳米技术学会

会议文集：2011传感器与MEMS技术产业化国际研讨会论文集

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  • 摘要：In this presentation, we discussed MEMS commercialization learning curve for MEMSensing Microsystems Co. Ltd. as a young Chinese MEMS startup. The company development is described in different stages. Both the problems and lessons are also discussed. We find our core value and form present business model after years of learning. Finally, some conclusions are discussed.
  • 摘要：A brief introduction to INO elpertise and business model will be presented. The main body of this presentation will illustrate INO unique contribution to design, manufacturing, and testing of Various MEMS devices used for optical display and optical beam scanning and modulation as well as detection of IR radiation.In particular, Various types of micro mirrors and micro mirromirror arrays will be presented including small-angle controlled tilt devices, the so called giant micro mirrors 3 mm in diameter for two-axis 60 degrees high-power laser beam scanning, and piston mirror arrays. A linear array of 2000 deformable micro mirrors for high一definition projection imaging will also be described. The technology of electrostatically-activated micro shutters will also be discussed.
  • 摘要：Complex SoC designs are facing increased challenges, including design Verification, design implementation and design integration. The presentation shall briefly review the trends in SoC design,introducing Cadence custom IC design solution for MEMS-IC design. Demanded by cost reduction,time-to-market, performance and reliability, electronic system integration is requiring to combine CMOS-IC with MEMS on a 3D system, and other sensors on a heterogeneous system, which adds up a comprehensive test technology, from MEMS testing, RF testing and design-for-test in IC chip. To design on higher performance chips and systems,from IC on Silicon一SoC-IP Realization to System with SW/rnHW co-design, Cadence has Visualized future needs called "EDA360”一”The Way Forward for Electronic Design".
  • 摘要：After the developed for few decades, MEMS technology in China is going to mature, which, at the same time, combined with the interest from the main IC manufacturers who are attracted by the increasing requirements in the MEMS market. Definitely, it is the time to commercialize the MEMS in China. This report just focuses on the possible problems in the procedure of MEMS R&D, production and marketing in China mainland, and presents the author's resolutions.
  • 摘要：Continuous inkjet (CIJ) technology has the advantage of much higher speed, better reliability, and wider ink and substrate latitude compared to drop-on-demand (DOD) inkjet technology. KODAK Stream Inkjet Technology is a breakthrough CIJ technology that provides a full digital printing solution offering high speed, superb image quality, and low cost. The core of Stream technology is a silicon chip made by the state-of-the-art micro-electro-mechanical systems (MEMS) fabrication process. This article reports the study of a CIJ device that has one pair of interactive nozzles per channel. Ink drops with large and small volumes are generated by thermal stimulation of high-speed liquid jet emitted from each nozzle. One pair of resistive heaters located around each nozzle is used to control the direction of the ink stream from each nozzle. Under proper conditions, the large drops from each of the pair of nozzles touch each other and merge laterally, while the small drops from each pair of nozzles remain separate. The lateral merging CIJ technology has the advantage of higher speed, better image quality, and less complicated printing system compared to single-nozzle-per-channel CIJ technology. Results from simulations and experimental studies are reported.
  • 摘要：MEMS Industry is growing double digits now and will continue its fast growth for the next decade.Bosch is one of the earliest pioneers of the MEMS technology, and invented the famous Bosch Process.MEMS products are already deep into our daily lives, and Bosch is developing various MEMS products to make our lives more comfortable. Here are some of the technologies which Bosch has developed to makethe world smallest MEMS sensors. New interesting use cases using MEMS sensors shall be also presented.
  • 摘要：MEMS devices require high topographic structures. Many of them cause problems for resist process withspin coating technique. Another problem is the high distance for exposure tool which reduce the resolution dramatically.In order to solve these problems, Suss developed spray coating technology and large gap exposureoptics. New development of so called MO (Microlens Optics) exposure Optics makes high resolution insubmicron area with large proximity distance possible.
  • 摘要：Research and Application of Micro-nano Thin Films Generated by Ion Beam Assisted Deposition (IBAD)Jinsheng Liu.This paper from the following aspects were introduced:1. Important research achievement;2. The main theoretical monographs;3. Publications.such asa. Ion Beam Technology and Applications (1995);b. Ion Beam Deposition of Thin Films and Applications (2003);c. Thin Film Formation Process and Structure (2005);d. Introduction to the characteristics of hard amorphous carbon (2007).
  • 摘要：Plasma, eYCited with microwave energy, has Very interesting properties which are in direct correlation with the eYCitation frequency. This is due to the reachable high electron density, which itself has an influence on the density of further generated particles like ions, radicals, excited atoms and molecules or UV light. Altogether they are responsible for the high chemical reactivity of microwave plasmas attaining their maximum in the pressure regime between 1 and a few hundred Pa. Therefore, comparatively low end pumping systems can be used to achieve good results in etching, activation and deposition processes. Together with the availability of microwave power, grown with the market of microwave heating technology, microwave plasma is an interesting tool for industrial applications. Scalability of power up to 100 kW per single magnetron tube and lateral dimensions of a few square meters per single plasma source have opened the field to industrial thin film technology for typical large area applications as solar or other flat panel industries.
  • 摘要：After many years developing, MEMS is getting blooming in consumer filed and become one of the driving force of new applications, especially Internet of Things since 2009. As the smart nodes on the IOT tree, MEMS sensors and actuators have huge market to be developing. How to make cheap, compatible,self-powering, large volume integrated smart devices becomes the major topics and trend in the world.Great efforts are engaging in combining MEMS into different IOT applications, both from Industry and academy. In this talk, Dr. Zhang will give an overview of the major techniques in this trend, also the approach of academy and industry collaboration to promote MEMS business into IOT, and finally she will talk about how to make a bright successful smart future with MEMS technology.
  • 摘要：The "Hands-on access fab" is a 4" and 6" facility that companies can easily access and utilize for their prototyping. The fab is shared with other users and managed with best efforts. The fab will not make contract development like MEMS foundry. Companies which have not own facility can dispatch their people to operate equipments by themselves. More than 20 companies have used the fab since the opening in November 2011. The fab targets to make barriers of MEMS development smaller.
  • 摘要：Radio Frequency MicroElectroMechanical System (RF MEMS) switches are Very promising MEMS devices ready to commercialize for wireless network, mobile phone, radar, instrumentation, and sensor applications. In this report, we will first review some of the MEMS devices fabricated at IMETU, the enabling technologies of making these devices, and their potentially industrial applications. And then,we will focus on RF MEMS switches and Bridge Type Resonators. Of these two kinds of MEMS devices, our RF MEMS switches show an eYCellent RF performance and reliability with a lifetime of 100 million switching cycles, and our Bridge Type Resonators as special MEMS switches have dimensions scale down to nano-size with eYCellent prisical and mechanical properties which will revolutionize the sensor technology. Finally, we will discuss the design and fabrication of phase shifter as a key element for MEMS switches, and several different RF MEMS switch packaging strategies for the purpose of commercialization.
  • 摘要：In MEMS fabrication, the end pointing is commonly achieved by using optical emission spectroscopy OES, simple reflectometry or possibly just by timing or parameter setting. In the presentation, we discuss some critical issues of optical spectroscopy and reflectometry(those methodologies require etchstop layer) with highlighting Claritas solution for structure with low open area.The key limitation of OES, reflectivity, etch time or parameter setting end point is that no information can be obtained about the etch rate or etch depth as the process progresses. The exposed stop layer is then removed usually with a wet etch. The use of an etch stop layer is inefficient, since in order to use this method additional fabrication steps are required. More critically, the stop layer material left behind (beneath the masked region) can affect the performance of the device being manufactured. Fully integrated interferometric end-point detection (IEPD) unit which monitors in-situ the etching process depth, requires no etch stop layer, provides a sensible solution to this issue.
  • 摘要：Advanced Semiconductor Manufacturing Corporation of Shanghai ("asmc", formerly known as Shanghai Philips Semiconductor Co., Ltd.), was incorporated in 1988. asmc, located in Caohejing High Technology Park, Shanghai, is One of the oldest analog foundries in the world. The company operates MEMS Fab, 5"Fab, 6" Fab and 8" Fab at present, and has an annual capacity of 800,000 pieces of wafers.As a leading foundry in China, we are devoted to providing Various processes for our semiconductor customers,including：MEMS, Bipolar, mixed-signal, BiCMOS, BCD, embedded non-Volatile memory, and so on.
  • 摘要：Initially developed in the United States for the military and defense applications, the uncooled infrared focal plane array (UIRFPA) detectors are now widely used in areas of electrical power industry,manufacturing industry, security and surveillance, automotive night-vision etc. due to its small size and low cost. It was projected that the total market value for the uncooled infrared will reach 3.4 billion dollars in 2016. UIRFPA is thus undoubtedly a very important application direction for the MEMS technology. And the market growth has attracted more players to enter this technical section. The UIRFPA is manufactured with semiconductor compatible CMOS-MEMS surface micromachining technology, itsstructure, processing technology, and packaging technology all have unique requirements and features,and it is a typical example to analysis the MEMS application in a commercial product. At the same time, the technology and trends have evolved significantly over the past 5 years, more and more suppliers are moving to foundry service instead of setting-up internal processing lines, which is driving towards lower production cost and open up more commercial applications. At the product level, the array size is increasing and the pixel pitch is continuously decreased. The packaging is moving from the hermetic metal house towards wafer level packaging (WLP).
  • 摘要：CMOS一MEMS and 3D integration are well recognized as the ultimate technology solutions forfurther miniaturized, low cost MEMS system IC manufacturing particularly to meet the ever stringenttechnical and economic requirements for smart phones, tablets and portable electronics as well asfuture wireless sensor network (WSN) applications. Under an expanded definition, the CMOS-MEMStechnology provides a series of silicon-based MEMS device fabrication technologies by leveraging quitebroad existing CMOS and/or CMOS compatible wafer processing toolset, capability and large scalemanufacturing infrastructure at low cost with high efficient and quality.
  • 摘要：Electric compasses are gaining importance as an important sensor in Various consumer electronics products. New sensor solutions are still interesting if they can simultaneously provide sufficient resolution,high stability, low power consumption, small form factor, and a low cost. Taking this as the goal, we havedesigned and fabricated micromechanical magnetometers intended for a 3D electronic compass whichcould be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator. Sensors for the three Cartesian components of the magnetic field Vector can be processed on the same chip. The Vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked loop circuit. The fabrication process is basedon aligned direct bonding of a double side polished and a SOI wafer. Magnetometers measuring the fieldcomponent along the chip surface have a flux density resolution of about 10 nT/Hz at a coil current of 100 uA.Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with flux density resolution of about 70 nT/Hz. Resolution is limited by the fundamental thermomechanical noise.
  • 摘要：USHIO is introducing the mass production system with large area projection elposure (8 inch one shot)and the high precision technology.As everybody knows, MEMS devices requires high alignment accuracy as well as the high precision patterning on high scallop area at photo lithography process. Especially, for the warped wafer, which canbe seen in the actuator mass production of various sensor devices, it is difficult to keep high alignment accuracy. Also, the market is still looking for a tool which achieves both high throughput of conventional contact elposure tool and high yield of reduction projection stepper.
  • 摘要：STMicroelectronics Technical Marketing ManagerSensor&High Performance ICs.Collins WU has been more than 10 years experience in semiconductor area, he is MEMS sensors and high performance ICs technical marketing manager in STMicroelectronics for CHINA. Collins is Very elperienced for CHINA MEMS market in Various segments.This article and the research works in this field are also introduced.
  • 摘要：This presentation introduces a new IC architecture and design technique which can be widely used for MEMS based sensors and wireless applications. The presented digital predistortion technique can achieve a high accurate system requirement (such as 0.2 ppm temperature-compensated crystal oscillator over the temperature of-40一GO degree)by digitally processing an output frequency signals of a low cost sensor.As a result, this presentation shows a design and test flow to greatly reduced the test time for MEMS based sensor devices.
  • 摘要：There is a big boost in demand of MEMS in the last two years driven by their use in consumer applications such as smart phones, tablets and gaming consoles. Yole Developpment predicts about 14%compound annual growth of MEMS for next five year with a market of $19.5B in 2016. This increasing demand for MEMS has brought in significant change in the MEMS manufacturing landscape. Currently MEMS manufacturing is dominated by IDMs. MEMS foundries have only about 9%share of total MEMS revenue. Majority of these MEMS foundries are involved in manufacturing of high Value and low Volume specialty MEMS products. However, with increasing demand, new business opportunities have emerged for high Volume manufacturing of MEMS by these foundries. There is also a trend of IDMs outsourcing their MEMS business to stay competitive in growing consumer market. Fables companies are also gearing up to grab a larger share of MEMS market. The competitive pressure has also accelerated the use of 8"substrate for MEMS. The growing business potential, as well as use of 8" infrastructure for MEMS fabrication, has also attracted some Integrated Circuits (ICs) foundries to enter into manufacturing of MEMS.
  • 摘要：The Medical Research Council and the UK Clinical Research Collaboration awarded a #4 million grant to the consortium of academic and industrial researchers to improve seYUal health through the use of new technologies. Brunel University in partnership with St. Georges Medical School, aIMSto develop self-test devices that can quickly identify any infection and communicate the information wirelessly with a mobile phone or computer to help patients understand and seek out treatment they might need.
  • 摘要：The most important question is how to fabricate the nano-structures and replicate the structures on the large substrates or films with low cost? The new micro-nano manufacturing systems have been introduced either for the research work, or for the industrial applications, including UV laser interference lithographic systems for the nano-patterning, such as the photonic crystals with the period of 400nm一SOOnm on the large size substrates，up to40", the roll-to roll nano imprinting systems.
  • 摘要：Making the world a smarter place is the goal of Freescale. Freescale Xtrinsic smart sensing solutions offer increased levels of integration combined with multiple sensor inputs, logic and other building blocks tobring greater Value and decision making to the overall sensing solution. In this speech, I will talk about how Freescale smart sensing solutions redefine the industry.
  • 摘要：Recent development of MEMS technologies at IMEC enables the monolithic integration of MEMS on CMOS. This approach represents a potential key advantage for a variety of MEMS systems as it can lead to a device performance improvement and to the scaling of the system area with consequent cost and package size reduction. Systems requiring multiple MEMS devices on chip or large MEMS array will benefit the most out of this approach.
  • 摘要：IntelliSense ignited the MEMS Industry in the early 1990's with its IntelliSuite. family of innovative CAD tools. Used by MEMS professionals worldwide for design, development and manufacturing of MEMS, IntelliSuite has firmly established itself as the Industry's standard tool. IntelliSuite provides MEMS companies and individual users with a complete living design environment to manage their MEMS product through its life cycle.

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