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Multi-channel free-space intra-chip optical interconnections: combining plastic micro-optical modules and VCSEL based OE-FPGA

机译:多通道自由空间内部光学互连:组合塑料微光模块和基于VCSEL的OE-FPGA

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We fabricated and replicated in semiconductor compatible plastics a multi-channel free-space optical interconnection module designed to establish intra-chip interconnections on an Opto-Electronic Field Programmable Gate Array (OE-FPGA). The micro-optical component is an assembly of a refractive lenslet-array and a high-quality microprism. Both components were prototyped using deep lithography with protons and were monolithically integrated using a vacuum casting replication technique. The resulting 16 channel module shows optical transfer efficiencies of 50% and inter-channel cross-talks as low as -22 dB. These characteristics are sufficient to establish multi-channel intra-chip interconnects with OE-FPGA's. The OE-FPGA we used was designed within a European co-founded MEL-ARI consortium, working towards a manufacturable solution for optical interconnects between CMOS IC's. The optoelectronic chip combines fully functional FPGA digital logic with the drivers, receivers and flip-chipped optoelectronic components. It features 2 optical inputs an 2 optical outputs per FPGA cell, amounting to 256 photonic I/O lins based on multi-mode 980 nm VCSELs and InGaAs detectors. With a careful alignment of the micro-optical free-space module above the OE-VLSI chip, we demonstrated for the first time to our knowledge, a multi-channel free-space intra-chip optical interconnection. Data-communication was achieved with 4 simultaneous channels working at 10Mb/s. The bitrate was limited by the chiptester. Norwithstanding the use of non-aggressive 0.6 μm CMOS technology the FPGA will provide an 80 Mbit/s information rate per channel using manchester encoded links. The whole chip therefore has in principle a peak aggregate signalling rate of approximately 20 GBit/s. This first demonstration paves the way for a practical solution to solve the electronic intra-chip interconnected bottleneck with low-cost mass-producible chip-compatible plastic micro-optical modules.
机译:我们制造和在半导体兼容塑料复制旨在建立上的光电现场可编程门阵列(OE-FPGA)芯片内的互连的多通道的自由空间光互连模块。所述微光学部件是折射微透镜阵列和高品质的微棱镜的组件。两个组分用深光刻与质子原型,使用真空浇铸复制技术进行单片集成。的50%将得到的16信道模块示出光学传递效率和信道间串扰低达-22分贝。这些特性是足以建立多通道芯片内互连与OE-FPGA的。我们使用OE-FPGA是欧洲共同创立MEL-ARI群落内的设计,对于朝之间的CMOS IC的光学互连可制造的解决方案工作。光电芯片联合机功能齐全的FPGA的数字逻辑与驱动器,接收器和倒装芯片式光电部件。设有2个光纤输入每FPGA细胞的2个光输出,达到基于多模式980nm的VCSEL和InGaAs检测256光子I / O Lins的。与微自由空间光模块的OE-VLSI芯片上方的仔细对准,我们证实首次就我们所知,多通道自由空间芯片内的光互连。数据通信用4个同步信道在10Mb的工作来实现/秒。比特率是由chiptester限制。 Norwithstanding使用非侵略性0.6微米CMOS技术的FPGA将使用曼彻斯特编码提供链接每通道80 Mbit / s的信息速率。因此,整个芯片具有在大约20千兆比特的原则的峰值骨料信令速率/秒。该第一示范铺平了解决电子芯片内的实际方案互连低成本大量生产芯片相容塑料微光学模块瓶颈的方式。

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