Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections

摘要

We propose alignment-free optical modules using a solder-bump-bonding technique for constructing free-space optical interconnection systems without a special alignment procedure. Bonding pads for mounting an optoelectronic device chip are fabricated by exposing a photosensitive resin film to light traveling through the optical system of the module so that the image positions of the bonding pads on both image planes of the optical interconnection system are aligned with each other. A device chip is mounted by solder-bump bonding and is set at a proper position by the surface tension of molten solder. The effectiveness of the technique is verified by constructing alignment-free optical modules. (C) 2008 The Optical Society of Japan.