首页> 外文会议>International Symposium on High Dielectric Constant and Other Dielectric Materials for Nanoelectronics and Photonice >Near Room-Temperature Liquid-Phase Deposition of Barium-doped TiO_2 on n-GaN and Its Application to AlGaN/GaN MOSHEMTs
【24h】

Near Room-Temperature Liquid-Phase Deposition of Barium-doped TiO_2 on n-GaN and Its Application to AlGaN/GaN MOSHEMTs

机译:N-GaN上钡掺杂TiO_2的室温液相沉积及其在Algan / Gan MoShemts应用

获取原文

摘要

Barium-doped TiO_2 films deposited on GaN layers at low temperature through a simple liquid-phase deposition method is investigated. The use as a gate dielectric in AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors (MOSHEMTs) is also demonstrated. The electrical characteristics of the metal-oxide-semiconductor (MOS) structure on n-doped GaN show that the leakage current density is about 5.09 × 10~(-9) A/cm~2 at 1 MV/cm, and the breakdown field is more than 13 MV/cm. The maximum drain current density of the AlGaN/GaN MOSHEMTs is higher than that of HEMTs, in which a wider gate voltage swing, a lower sub-threshold swing (112mV/dec), and a higher I_(ON)/I_(OFF) ratio (4.5×10~5) are obtained.
机译:研究了通过简单的液相沉积法在低温下沉积在GaN层上的钡掺杂TiO_2薄膜。还证明了作为AlGaN / GaN金属氧化物半导体高电子迁移率晶体管(MOSHEMTS)的用作栅极电介质。在N掺杂GaN上的金属氧化物半导体(MOS)结构的电特性表明,漏电流密度为1mV / cm的漏电流密度为约5.09×10〜(-9)A / cm〜2,以及击穿场超过13 mv / cm。 AlGaN / GaN MOSHEMTS的最大漏极电流密度高于HEMTS的最大漏极电流密度,其中更宽的栅极电压摆动,较低的子阈值摆动(112mV / DEC),更高的I_(ON)/ I_(OFF)获得比率(4.5×10〜5)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号