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机译:室温射频磁控溅射实现的具有高品质$ hbox {Gate} $ – $ hbox {SiO} _ {2} $的AlGaN / GaN MOSHEMT
Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, IL, USA;
$hbox{Gate}$– $hbox{SiO}_{2}$; GaN; metal–oxide–semiconductor high-electron-mobility transistor (MOSHEMT); radio frequency (RF) magnetron sputtering;
机译:短期直流偏置引起的应力对以液相沉积$ hbox {Al} _ {2} hbox {O} _ {3} $作为栅介质的n-GaN / AlGaN / GaN MOSHEMT的影响
机译:在Si(111)衬底上制造$ hbox {SiO} _ {2} $栅极绝缘体的AlGaN / GaN MOSHEMT的高温性能
机译:具有AlGaN背势垒的3000-V 4.3- $ hbox {m}Ωcdot hbox {cm} ^ {2} $ InAlN / GaN MOSHEMT
机译:AlGaN / GaN MOS-HEMTS使用RF磁控溅射SiO_2栅极绝缘体和退火处理
机译:射频磁控溅射生长的GaN薄膜的特性用于制造AlGaN / GaN HEMT生物传感器
机译:氧等离子体处理对采用PECVD SiO2栅极绝缘体的原位SiN / AlGaN / GaN MOSHEMT的影响
机译:通过从GaN粉末获得的射频磁控溅射生长的未掺杂GaN层的结构和光学变化