Design and Analysis of Vacuum Robot for Cluster Tools

摘要

In this paper, a SCARA type vacuum robot for cluster tools has been designed, which can transfer semiconductor wafers in high vacuum chamber. The robot should be able to perform radial linear extending and retracting movement R, rotation movement θ , and vertically up-down movement Z. The rotation and radial linear movements are driven by direct drive motors which located in atmosphere environment, two magnetic couplings are applied to transmit the torques from atmosphere to vacuum environment. The dynamics model of the robot is builded, control system is set up.