SOLDERING PASTE PRINTING METHOD, SOLDERING PASTE PRINTING MACHINE, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING SOLDER PRINTING LAYER

摘要

PROBLEM TO BE SOLVED: To provide a soldering paste printing method which can form a solder printing layer of a uniform thickness in relation to a large-size wiring board.;SOLUTION: Tabular masks 21 having a plurality of through holes 24 formed corresponding to a plurality of connectors 43 are arranged to overlap each other on the printed surface 42 of the approximately polygonal wiring board 41. In the wiring board 41, the length of one side is at least 300 mm, and the connectors 43 are set on the printed surface 42. Squeegees 26 are contacted with the outer surfaces of the masks 21. In this state, the squeegees 26 are moved along the outer surfaces of the masks 21, and the soldering paste 47 is packed in the through holes 24 to form a printing layer 46. The edge of one of the masks arranged on the printed surface 42 of the wiring board 41 is relatively separated in relation to the printed surface 42, so that the masks 21 are removed.;COPYRIGHT: (C)2004,JPO