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Design and modeling of non-uniformly doped deep-submicron pocket MOSFETs for low-voltage low-power applications

机译:用于低压低功率应用的非均匀掺杂深亚微米口袋MOSFET的设计和建模

摘要

Laterally non-uniformly doped 0.1-μm pocket n-MOSFETs satisfying specifications of off-state current, on-state current, sensitivity of off-state current to channel length and 1V power-supply voltage have been designed for low-voltage low-power applications. To determine a viable range of the deep-submicron pocket n-MOSFET structural parameters---the dopant concentration at the center region (Nc), the dopant concentration at the pocket region (Np) and the length of the pocket region (Lp), a unique viable design space locating the deep-submicron devices meeting all the device specifications have been constructed, using computer algorithms developed and implemented in the programming language of the two-dimensional device simulator, Medici. For known Nc, vs. Lp, the pocket n-MOSFETs for low-power applications are located in an upper area of higher Np vs. Lp of the viable design space while the devices for high-performance applications are located in a lower area of lower Np vs. Lp of the viable design space. Well-designed deep-submicron pocket n-MOSFETs prove to be promising candidates to improve short-channel effects as well as switching performance in comparing the 0.1-μm pocket n-MOSFETs located within the viable design space to 0.1-μm conventional bulk n-MOSFETs selected to meet the same specifications. The 0.1-μm pocket n-MOSFETs located within the viable design space can be partitioned into two types of pocket devices based on gate controllability of channel- and depletion-layer charges. Analytical models for subthreshold and above-threshold currents in the deep-submicron pocket n-MOSFETs have been developed for the first time to generate the off-state and the on-state currents, and the design-space boundaries for the on- and the off-state currents. The models are based on solutions of the drift-diffusion current transport and the 1-D Poisson's equations, the charge sheet approximation, subthreshold surface potential models based on solutions of the quasi-two-dimensional Poisson's equation, a quasi-two-dimensional velocity saturation model, realistic mobility models, and analytical formulas for model parameters. The analytical models provide explicit relations between process, device and model parameters of the deep-submicron pocket n-MOSFETs, and reduce time and cost of the two-dimensional device simulation. Some algorithms developed for generating ID - V DS characteristics and constructing the design-space boundaries are described.
机译:针对低压低功耗设计了横向非均匀掺杂的0.1μm口袋型n-MOSFET,其满足关态电流,导通电流,关态电流对沟道长度的敏感性以及1V电源电压的规格应用程序。为了确定深亚微米口袋n-MOSFET结构参数的可行范围-中心区域(Nc)的掺杂剂浓度,口袋区域(Np)的掺杂剂浓度和口袋区域的长度(Lp) ,使用二维设备模拟器Medici的编程语言开发和实现的计算机算法,已经构建了一个独特的可行设计空间,可以定位满足所有设备规格的深亚微米设备。对于已知的Nc与Lp相比,用于低功率应用的袋装n-MOSFET位于较高Np与可行设计空间的Lp的上部区域,而用于高性能应用的器件位于Np与Lp的下部区域。较低的Np与可行设计空间的Lp。设计精良的深亚微米袋装n-MOSFET被证明是有希望的候选者,通过将可行设计空间内的0.1μm袋装n-MOSFET与0.1μm的常规体n-MOSFET进行比较,可以改善短沟道效应以及开关性能。选择满足相同规格的MOSFET。根据通道层和耗尽层电荷的栅极可控性,位于可行设计空间内的0.1μm口袋型n-MOSFET可以分为两种类型的口袋型器件。首次开发了深亚微米口袋n-MOSFET中亚阈值和阈值以上电流的分析模型,以生成截止状态和导通状态电流以及导通和导通状态的设计空间边界。断态电流。这些模型基于漂移-扩散电流传输和一维Poisson方程的解,电荷表近似,基于准二维Poisson方程解的亚阈值表面电势模型,准二维速度饱和度模型,真实的迁移率模型以及模型参数的解析公式。该分析模型提供了深亚微米口袋n-MOSFET的工艺,器件和模型参数之间的明确关系,并减少了二维器件仿真的时间和成本。描述了一些用于生成ID-V DS特性和构造设计空间边界的算法。

著录项

  • 作者

    Pang Yon Sup;

  • 作者单位
  • 年度 2000
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  • 原文格式 PDF
  • 正文语种 en_US
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