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Interdigitated 50 nm Ti electrode arrays fabricated using XeF_2 enhanced focused ion beam etching

机译:使用XeF_2增强聚焦离子束刻蚀制造的叉指式50 nm Ti电极阵列

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摘要

The fabrication of interdigitated titanium nanoelectrode arrays of 50 nm in width and spacing is described in this work. The nanoarrays have been realized using a Ga~+ focused ion beam (FIB). FIB milling is typically accompanied by redeposition of removed material, which represents an important hindrance for milling closely spaced nanostructures. Redeposition effects have been reduced by means of XeF_2 gas assistance, which increases the etch yield by a factor of seven compared with pure ion milling. Furthermore, we used a simple adsorption model, which led to the conclusion that dwell time and refresh time should be < 500 ns and > 30 ms, respectively, for optimized XeF_2 assisted Ti milling. The measured resistance R of the electrodes is higher than 1 G OMEGA.
机译:在这项工作中描述了宽度和间距为50 nm的叉指式钛纳米电极阵列的制造。纳米阵列已经使用Ga +聚焦离子束(FIB)实现。 FIB研磨通常伴随着去除材料的重新沉积,这代表了研磨紧密间隔的纳米结构的重要障碍。 XeF_2气体辅助降低了再沉积效果,与纯离子铣削相比,XeF_2气体辅助将蚀刻产量提高了七倍。此外,我们使用了简单的吸附模型,得出的结论是,对于优化的XeF_2辅助Ti铣削来说,停留时间和刷新时间分别应小于500 ns和大于30 ms。电极的测量电阻R高于1 G OMEGA。

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