Multi-scale Modeling and Numerical Analysis of Thermal Behavior of Cu-Al Interface Structure in Microano Manufacturing

摘要

A multi-scale model is proposed for interfacial thermal conduction of Cu-Al interface in this paper. A TTM-MD model is adopted hereby to explore the electron-phonon scattering at the interface of different metals. The simulation results show that the temperature distribution is non-uniform along the interface, and there exist large temperature gradient some places and even sever plastic deformation. It is concluded that the stress near the interface is caused by dissimilarity of material. The present atomic-based multi-scale model is computationally efficient for interfacial thermal conduction on microano scales, and the present theory can be easily extended to other interfacial behaviors of dissimilar materials in microano manufacturing.