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Effect of catalyst shape on etching orientation in metal-assisted chemical etching of silicon

机译:金属硅化学腐蚀中催化剂形状对腐蚀取向的影响

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摘要

Silicon nanowires with vertical, slanting and zigzag architectures have been fabricated by metal-assisted chemical etching of silicon wafers (n-Si(100), n-Si(111) and n-Si(110)). Two types of zigzag SiNWs with various turning angles (125° and 150°) were obtained via metal-assisted chemical etching using non-Si(100) wafers. The observations reveal that the etching direction of non-Si(100) wafers depends on the shape of the deposited metal catalyst. A proposed mechanism, considering longitudinal and lateral etching, has been developed to explain the etching beha
机译:具有垂直,倾斜和锯齿形架构的硅纳米线已经通过硅晶片(n-Si(100),n-Si(111)和n-Si(110))的金属辅助化学蚀刻制成。通过使用非Si(100)晶片的金属辅助化学蚀刻,获得了两种具有不同转向角(125°和150°)的锯齿形SiNW。观察结果表明,非Si(100)晶片的蚀刻方向取决于沉积的金属催化剂的形状。考虑纵向和横向蚀刻的机制已被开发,以解释蚀刻行为

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