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Resist free patterning of nonpreferential buffer layers for block copolymer lithography

机译:用于嵌段共聚物光刻的非优先缓冲层的无抗蚀剂构图

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摘要

We report the design of a direct electron beam patternable buffer layer to spatially control the orientation of the microdomains in an overlaying polystyrene-block-poly(methyl methacrylate) (PS-b-PMMA) block copolymer (BCP) film. The buffer layer consists of a surface anchored low molecular weight PS-b-PMMA, with the PMMA segment anchored to the surface and a short PS block at the buffer layer/BCP interface. The block architecture of the buffer layer combines the essential features of "bottom up" and "top down" approaches as it functions as a nonpreferential layer to dictate perpendicular orientation of BCP domains from the substrate interface and as an e-beam resist to allow top-down lithographic process to spatially define the buffer layer on the substrate. The composition of the buffer layer can be tuned by changing the relative block lengths to create a nonpreferential surface which effectively induces perpendicular orientation of domains in an overlying BCP film. The grafted block copolymer can be locally shaved by e-beam lithography resulting in spatial control of domain orientation in the BCP film. The direct patterning approach reduces the number of steps involved in forming chemical patterns by conventional lithography.
机译:我们报告了直接电子束可图案化缓冲层的设计,以空间控制覆盖聚苯乙烯-嵌段-聚(甲基丙烯酸甲酯)(PS-b-PMMA)嵌段共聚物(BCP)膜中的微区的方向。缓冲层由表面锚定的低分子量PS-b-PMMA组成,PMMA片段锚定在表面上,并且在缓冲层/ BCP界面处有一个短PS嵌段。缓冲层的块结构结合了“自下而上”和“自上而下”方法的基本特征,因为它起着非优先层的作用,指示BCP域从衬底界面的垂直方向,并用作电子束抗蚀剂以允许顶部向下光刻工艺以在空间上限定衬底上的缓冲层。缓冲层的组成可以通过改变相对的嵌段长度来调节,以产生非优先表面,该非优先表面有效地诱导上覆BCP膜中畴的垂直取向。可以通过电子束光刻技术对接枝的嵌段共聚物进行局部剃刮,从而实现BCP膜中畴取向的空间控制。直接图案化方法减少了通过传统光刻形成化学图案所涉及的步骤数量。

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