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One-step H2S reactive sputtering for 2D MoS2/Si heterojunction photodetector

机译:用于2D MOS2 / SI异质结光电探测器的一步H2S反应溅射

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摘要

A technique for directly growing two-dimensional (2D) materials onto conventional semiconductor substrates, enabling high-throughput and large-area capability, is required to realise competitive 2D transition metal dichalcogenide devices. A reactive sputtering method based on H2S gas molecules and sequential in situ post-annealing treatment in the same chamber was proposed to compensate for the relatively deficient sulfur atoms in the sputtering of MoS2 and then applied to a 2D MoS2/p-Si heterojunction photodevice. X-ray photoelectron, Raman, and UV-visible spectroscopy analysis of the as-deposited Ar/H2S MoS2 film were performed, indicating that the stoichiometry and quality of the as-deposited MoS2 can be further improved compared with the Ar-only MoS2 sputtering method. For example, Ar/H2S MoS2 photodiode has lower defect densities than that of Ar MoS2. We also determined that the factors affecting photodetector performance can be optimised in the 8-12 nm deposited thickness range.
机译:需要将二维(2D)材料直接生长在常规半导体基板上,实现高通量和大面积能力,以实现竞争性2D过渡金属二均甲基化物装置。 提出了一种基于H2S气体分子的反应性溅射方法和在同一室中的原位退火处理的顺序处理,以补偿MOS2的溅射中的相对缺陷的硫原子,然后施加到2D MOS2 / P-Si异质结光电探测。 进行X射线光电子,拉曼和uV可见光光学分析的沉积AR / H2S MOS2膜,表明与仅AR-POS2溅射相比,可以进一步提高沉积MOS2的化学计量和质量 方法。 例如,AR / H2S MOS2光电二极管比AR MOS2的缺陷密度较低。 我们还确定影响光电探测器性能的因素可以在8-12nm沉积的厚度范围内进行优化。

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