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Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

SCIEI

中文名称：焊接和表面贴装技术

ISSN：0954-0911
出版周期：3 times a year

发文量：381

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1.Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

机译：真空气相焊接系统中蒸汽浓度降低对焊点温度的影响
- 作者：Illes Balazs;Skwarek Agata;Geczy Attila;Jakab Laszlo;Busek David;Dusek Karel
- 期刊名称：《Soldering & Surface Mount Technology》 | 2018年第2期
- Reflow soldering;
- Numerical simulation;
- Gas void;
- Vacuum VPS;
2.Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect

机译：在综合应用下，球栅阵列接头的可靠性评估：焊接几何效应
- 作者：Kurrrar Sathish;Kuzichkin Oleg R.;Siddiqi Ahmed Faisal;Pustokhina Inna;Krasnopevtsev Aleksandr Yu
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第1期
- Solder joints;
- Thermal fatigue;
- Reliability;
- Ball grid array (BGA);
3.Application of multi-quality parameter design in the optimization of underfilling process - a case study of a vehicle electronic module

机译：多质量参数设计在填埋过程优化中的应用 - 以车辆电子模块为例
- 作者：Huang Chien-Yi;Shen Li-Cheng;Wu Ting-Hsuan;Greene Christopher
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第2期
4.Optimization of solder paste quantity considering the properties of solder joints

机译：考虑焊点性能的焊膏数量优化
- 作者：Hirman Martin;Steiner Frantisek
- 期刊名称：《Soldering & Surface Mount Technology》 | 2017年第1期
- Shear strength;
- Intermetallic compound;
- Solder paste;
- Electrical resistance;
- Quantity of solder pastes;
- Voids area;
5.Influence of aging on microstructure and hardness of lead-free solder alloys

机译：老化对无铅焊料合金微观结构和硬度的影响
- 作者：Morando Carina;Fornaro Osvaldo
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第1期
6.Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

机译：使用新型能源建模的功率半导体焊点的热机械疲劳寿命评估
- 作者：Zhang Buen;Jabarullah Noor H.;Alkaim Ayad F.;Danshina Svetlana;Krasnopevtseva Irina V.;Zheng Yuan;Geetha Nisith
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第3期
- Electronic devices;
- Creep strain;
- Strain energy density;
- Temperature profile;
7.Wetting properties of Nd:YAG laser treated copper by SAC solders

机译：Nd的润湿性质：囊焊接的YAG激光处理过的铜
- 作者：Hlinka Jozsef;Berczeli Miklos;Buza Gabor;Weltsch Zoltan
- 期刊名称：《Soldering & Surface Mount Technology》 | 2017年第2期
- Microstructure;
- Sn-Ag-Cu;
- Solder;
- Wetting;
- Laser treatment;
8.Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning

机译：基于本地到全球集合学习的IC焊点自动光学检测系统
- 作者：Chen Wenjie;Cai Nian;Wang Huiheng;Lin Jianfa;Wang Han
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第2期
9.Spatial analysis of underfill flow in flip-chip encapsulation

机译：倒装芯片封装中填埋流的空间分析
- 作者：Ng Fei Chong;Zawawi Mohd Hafiz;Abas Mohamad Aizat
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第2期
- Electronic packaging;
- Void formation;
- Capillary underfill process;
- Contact line jump;
- Flip-chip;
- Meniscus evolution;
10.Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps

机译：具有细小铜柱凸块WLP的热电机械可靠性分析
- 作者：Sun Haiyan;Gao Bo;Zhao Jicong
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第3期
- Sn-Ag-Cu;
- Thermal fatigue;
- Solder bumps;
- Wafer-level package (WLP);
11.Property of Sn-37Pb solder bumps with different diameter during thermal shock

机译：SN-37PB焊料凸起，热冲击期间不同直径的凸起
- 作者：Gan Guisheng;Yang Donghua;Wu Yi-ping;Liu Xin;Sun Pengfei;Xia Daquan;Cao Huadong;Jiang Liujie;Tian Mizhe
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第2期
- Sn-37Pb;
- Thermal shock;
- Shear strength;
- Failure;
- Tearing crack;
- Microstructure;
- Solder bumps;
- Fatigue;
- Tensile testing;
12.Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

机译：电流源和电压源逆变器中功率半导体中焊点的有用寿命估计
- 作者：Zou Hao;Xie Fang;Du Bo;Kavithaa G.
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第3期
- Sn-Ag-Cu;
- Solder joints;
- Thermal fatigue;
- Useful lifetime;
13.Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

机译：随机振动频率下焊球接头疲劳寿命的装置结构优化
- 作者：Gao Yang;Wang Fuwei;Ding Shaohu;Yang Bin;Liu Lin;Salmani Mohammad
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第1期
- Vibration;
- Solder joints;
- Fatigue;
- Power spectral density;
- Ball grid array (BGA);
14.Optimized cerium addition for microstructure and mechanical properties of SAC305

机译：优化的铈添加组织和SAC305的机械性能
- 作者：Muhammad Riaz;Ali Umair
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第4期
- Intermetallic compounds;
- Microstructure;
- Tensile behavior;
- Cerium;
- Tin-Silver-Copper;
15.An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

机译：电子系统中焊点机械随机振动疲劳损伤的调查
- 作者：Wang Feng;Zhang Fangfang;Huang Qixiang;Salmani Mohammad
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第3期
- Fatigue;
- BGA packaging;
- Solder joint;
- Vibration test;
16.Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

机译：加纳Kumasi原位热循环下C-Si太阳能电池互连的寿命预测
- 作者：Nyarko Frank Kwabena Afriyie;Takyi G.
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第4期
- Interconnection;
- Reliability;
- Life prediction;
- Accumulated creep energy density;
- Strain damage;
17.The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure

机译：BI添加对SAC405焊缝电气和微观结构性能的影响
- 作者：Soares Delfim;Sarmento Manuel;Barros Daniel;Peixoto Helder;Figueiredo Hugo;Alves Ricardo;Delgado Isabel;Teixeira Jose C.;Cerqueira Fatima
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第1期
- Bi additive;
- Four-point probe method;
- Microstructural properties;
- Solder electrical properties;
18.Machine learning framework for predicting reliability of solder joints

机译：用于预测焊点可靠性的机器学习框架
- 作者：Sung Yi;Robert Jones
- 期刊名称：《Soldering & Surface Mount Technology》 | 2020年第2期
- Thermal fatigue;
- Machine learning;
- Solder joints failure prediction;
- Thermal cycling;
- Cracks;
- Drop;
19.Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder

机译：CNT加固SN-1.0AG-0.5CU焊料中Cu-Sn金属间质的激活能量
- 作者：Ramani Mayappan;Amirah Salleh;Nurul Atiqah Tokiran;N. A. Awang
- 期刊名称：《Soldering & Surface Mount Technology》 | 2020年第2期
- Lead-free solder;
- Growth rate;
- Activation energy;
- Carbon nanotube;
20.Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature

机译：低温下超声波辅助Cu / SAC0307粉末/ Cu接头特性的影响
- 作者：Gan Gui-sheng;Jiang Liujie;Chen Shiqi;Deng Yongqiang;Yang Donghua;Jiang Zhaoqi;Cao Huadong;Tian Mizhe;Xu Qianzhu;Liu Xin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第4期
- SAC0307;
- Low temperature;
- Micron-size powders;
- Ultrasound assisted;
21.Performance of 96.5Sn-3Ag-0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

机译：等温老化和高电流应力下96.5Sn-3Ag-0.5Cu /富勒烯复合焊料的性能
- 作者：Chen Guang;Cui Xinzhan;Wu Yaofeng;Li Wei;Wu Fengshun
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第1期
- Composite solder;
- Isothermal ageing;
- Electro-migration;
- Microstructures;
- Mechanical properties;
22.The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces

机译：SAC405 / Cu和SAC405 / Enimag焊接接口形成金属间层结构的形成
- 作者：Mohamed Anuar Rabiatul Adawiyah;Osman Saliza Azlina
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第2期
- Reflow soldering;
- Intermetallic compound;
- Isothermal aging;
- ENImAg;
- Thickness;
23.An experimental study of carbonyl powder power inductor cracking during reflow process

机译：回流过程中羰基粉末动力电感裂纹的实验研究
- 作者：Rehman Faisal;Asghar Rafiq;Iqbal Kashif;Aman Ali;Nawaz Agha Ali
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第2期
- Crack;
- Thermal shock;
- Carbonyl powder ceramic inductor;
- Power inductor;
- Reflow oven;
- Reflow profile;
24.Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

机译：高温老化期间AU / SNSB-CUNIAG /（AU）NI的微观结构演化
- 作者：Bangyao Han;Fenglian Sun;Tianhui Li;Yang Liu
- 期刊名称：《Soldering & Surface Mount Technology》 | 2020年第2期
- Au-Sn phases;
- Full-compound joint;
- IMC evolution;
- Isothermal aging;
- Microstructure evolution;
25.Mechanical reliability of self-aligned chip assembly after reflow soldering process

机译：回流焊接过程后自对准芯片组件的机械可靠性
- 作者：Mokhtar Mohd Najib Ali;Abdullah M. Z.;Saad Abdullah Aziz;Cheani Fakhrozi
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第1期
- Lead-free solder;
- Reliability;
- Shear stress;
- Solder joint;
- Self-alignment;
26.Investigation on effects of solder paste voids on thermal and optical performance of white high-power surface-mounted device LEDs

机译：焊膏空隙对白色高功率表面件LED热敏和光学性能的研究
- 作者：Muna Raypah;Mutharasu Devarajan;Shahrom Mahmud
- 期刊名称：《Soldering & Surface Mount Technology》 | 2020年第2期
- Thermal resistance;
- Solder paste;
- Voids;
- Junction temperature;
- Light-emitting diodes;
- ThinGaN;
27.Effect of Sb additions on the creep behaviour of low temperature lead-free Sn-8Zn-3Bi solder alloy

机译：Sb添加对低温无铅Sn-8Zn-3Bi焊料合金蠕变行为的影响
- 作者：Ren Guang;Collins Maurice
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第3期
- Alloys;
- Pb-free;
- Creep;
- Low temperature solder;
- Creep models;
- SnZnBi;
28.Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

机译：Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted
- 作者：Gan Guisheng;Chen Shi-qi;Jiang LiujieLiu CongMa PengHuang TianCheng DayongLiu Xin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第4期
- Mixed powder solders;
- Soldering temperature;
- Shear strength;
- Ultrasonic-assisted;
- Interfacial IMCs;
- SAC;
- SPOT-WELDED-JOINTS;
- FREE SOLDER ALLOY;
- MECHANICAL-PROPERTIES;
- MICROSTRUCTURE EVOLUTION;
- NI;
- PERFORMANCE;
- STRENGTH;
- BEHAVIOR;
29.Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact

机译：Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact
- 作者：Belhenini Soufyane;El Fatmi Imad;Richard CarolineTougui Abdellah
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第4期
- FEM;
- Crack;
- J-integral;
- Drop impact;
- Flip-chip;
- SAC;
- FREE SOLDER JOINTS;
- RELIABILITY;
- FAILURE;
30.Hot tear cracks on the suppression of Sn-Bi alloy for low-temperature assembly

机译：Hot tear cracks on the suppression of Sn-Bi alloy for low-temperature assembly
- 作者：Qu Songtao;Shi Qingyu
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第4期
31.Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

机译：Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures
- 作者：Lin Wei;Li Xuewen;Tu BingZhang ChaohuaLi Yulong
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第4期
- Lead-free solder;
- Interfacial reaction;
- Sn-Bi-Zn;
- Spreading phenomena;
- Wetting kinetics;
- SN-BI;
- MECHANICAL-PROPERTIES;
- MICROSTRUCTURE;
- JOINTS;
- AG;
- BEHAVIORS;
- ADDITIONS;
- ALLOYS;
- METAL;
32.Drop and impact reliability investigation of BGA and LGA interconnects

机译：Drop and impact reliability investigation of BGA and LGA interconnects
- 作者：Gharaibeh Mohammad A.;Pitarresi James M.
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第4期
- Reliability;
- Land grid array (LGA);
- Ball grid array (BGA);
- Drop test;
- Lead-free soldering;
- ELECTRONIC ASSEMBLIES;
- VIBRATION RELIABILITY;
- SOLDER JOINTS;
33.An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

机译：An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model
- 作者：Lai Yangyang;Pan Ke;Cen YuqiaoYang JunboCai ChongyangYin PengchengPark Seungbae
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第5期
34.Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing

机译：Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing
- 作者：Chen Guang;Wu Yao-Feng
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第3期
- Lead-free solder;
- Thermo-migration;
- Microstructures;
- Compositional evolution;
- Composition;
- Composite solder;
- Thermal stressing;
- MECHANICAL-PROPERTIES;
- THERMOMIGRATION;
- JOINTS;
- ELECTROMIGRATION;
35.ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

机译：ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder
- 作者：Al-sorory Hamed;Gumaan Mohammed S.;Shalaby Rizk Mostafa
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第3期
- Melt-spun process;
- Microhardness;
- Nano-reinforced lead-free solder;
- SAC355;
- Nano-ZnO;
- DEBYE TEMPERATURE;
- AL2O3 NANOPARTICLES;
- HEAT-CAPACITY;
- CU;
- MICROSTRUCTURE;
- SIZE;
- RESISTANCE;
- ADDITIONS;
- DESIGN;
- NICKEL;
36.Surface energetic-based analytical filling time model for flip-chip underfill process

机译：Surface energetic-based analytical filling time model for flip-chip underfill process
- 作者：Ng Fei Chong;Abas Mohamad Aizat
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第5期
- Electronic packaging;
- Underfill encapsulation;
- Analytical filling time model;
- Capillary flow;
- Flip-chip;
37.Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process

机译：Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process
- 作者：Ng Fei Chong;Abas Aizat;Ramli Mohamad RiduwanSharif Mohamad Fikri MohdAni Fakhrozi Che
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第3期
- Crack propagation;
- Delamination;
- Multi-layer ceramic capacitor (MLCC);
- Thermal mismatch;
- Reflow;
- Voids;
- Modelling;
- CRACK SUPPRESSION;
- RESIDUAL-STRESS;
- VAPOR-PRESSURE;
- GROWTH;
38.Simulation of jet printing of solder paste for surface mounted technology

机译：Simulation of jet printing of solder paste for surface mounted technology
- 作者：Martensson Gustaf Eric;Gohl Johan;Mark Andreas
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第5期
- Multiphase flow;
- Numerical simulation;
- Surface mount technology;
- Solder paste;
- Immersed boundary method;
- Jet printing;
39.Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging

机译：Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging
- 作者：Zhai Xinmeng;Chen Yue;Li YuefengZou JunShi MingmingYang Bobo
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第5期
- Aging conditions;
- Ni-MWCNTs;
- Mechanical strength;
- Photoelectric and thermal;
- LED;
- BEHAVIOR;
- MICROSTRUCTURE;
40.Design criteria for pad and stencil with high pick-and-Place yield

机译：Design criteria for pad and stencil with high pick-and-Place yield
- 作者：Huang Chien-Yi;Greene Christopher;Chan Chao-ChiehWang Ping-Sen
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第3期
- TOPSIS;
- System in package;
- Taguchi experimental design;
- Pad design;
- Signal and noise ratio;
- Surface mount technology;
- OPTIMIZATION;
- PERFORMANCE;
41.Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

机译：Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
- 作者：Gan Guisheng;Chen Shiqi;Jiang LiujieXu QianzhuHuang TianCheng DayongLiu Xin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第3期
- Zn-particles;
- SAC0307;
- Aging temperature;
- Shear strength;
- IMCs;
- Ultrasonics;
- AG-CU SOLDERS;
- MICROSTRUCTURE EVOLUTION;
- AL;
42.Predictive model of the solder paste stencil printing process by response surface methodology

机译：Predictive model of the solder paste stencil printing process by response surface methodology
- 作者：Chen Chun-Sheng;Wang Hai;Kao Yung-ChinLu Po-JenChen Wei-Ren
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第5期
- Surface mount technology;
- Response surface method;
- Solder paste;
- Stencil printing;
- OPTIMIZATION;
- HYBRID;
43.Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles

机译：Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles
- 作者：Wang Jianhua;Xu Hongbo;Zhou LiLiu XimingZhao Hongyun
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第2期
- Sn3.5Ag;
- Magnetic reinforcement;
- Metallurgical reaction;
- Microhardness;
44.Effect of the IMC layer geometry on a solder joint thermomechanical behavior

机译：Effect of the IMC layer geometry on a solder joint thermomechanical behavior
- 作者：Capela Paulina Araujo;Souza Maria Sabrina;Costa SharlaneTeixeira Jose C.Fernandes MiguelFigueiredo HugoDelgado IsabelSoares Delfim
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第2期
- PCBA;
- CTE mismatch;
- Solder joints;
- Reliability;
- Surface mount technology;
- RELIABILITY;
- SAC305;
45.Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes

机译：Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes
- 作者：Raypah Muna E.;Devarajan Mutharasu;Mahmud Shahrom
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第5期
- Thermal resistance;
- Substrate;
- Electrical power;
- Light-emitting diodes;
- Luminous flux;
- Thermal interface material;
46.Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

机译：Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies
- 作者：Olenev Leonid Anatolevich;Zakieva Rafina Rafkatovna;Smirnova Nina NikolaevnaShichiyakh Rustem AdamovichErshov Kirill AleksandrovichGeetha Nisith
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期
- Sn-Ag-Cu;
- Solder alloys;
- Electronic assembly;
- Thermo-mechanical fatigue;
- Solder joint;
- FATIGUE LIFE;
- THERMOMECHANICAL RELIABILITY;
- INTERFACIAL REACTIONS;
- STRAIN-RATE;
- AG CONTENT;
- CREEP;
- MICROSTRUCTURE;
- PREDICTION;
- DAMAGE;
- MODEL;
47.Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn-3.0Ag-0.5Cu/Cu solder joints

机译：Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn-3.0Ag-0.5Cu/Cu solder joints
- 作者：Said Mardiana;Mohd Nazeri Muhammad Firdaus;Mohd Sharif NurulakmalMohamad Ahmad Azmin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期
- Microstructure;
- Tensile strength;
- Microwave hybrid heating;
- Solder reflow;
- Susceptor;
- LEAD-FREE SOLDER;
- INTERFACIAL IMC GROWTH;
- MECHANICAL-PROPERTIES;
- CU;
- BEHAVIOR;
- ALLOY;
- NANOPARTICLE;
- EVOLUTION;
- SUBSTRATE;
- STRENGTH;
48.Detection of solder paste defects with an optimization-based deep learning model using image processing techniques

机译：Detection of solder paste defects with an optimization-based deep learning model using image processing techniques
- 作者：Sezer Au;Altan Aytac
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第5期
- Convolutional neural network;
- Deep learning;
- Optimization;
- Printed circuit board;
- Signal processing;
- Soldering defects;
49.Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes

机译：Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes
- 作者：Yeo Siang Miang;Yow Ho Kwang;Yeoh Keat Hoe
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第4期
- Vacuum reflow;
- Pressure cure;
- Solder void;
- Void-less;
- Packaging;
- DIE-ATTACH;
- POWER;
50.IC solder joint inspection via adaptive statistical modeling

机译：IC solder joint inspection via adaptive statistical modeling
- 作者：Xiao Meng;Cai Nian;Mo ZhuokunYan ShuleTian NiliJingWang Han
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第3期
51.Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions

机译：Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions
- 作者：Li Wangyun;Liu Linyiang;Li Xingmin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第2期
- Sn58Bi;
- Sn3;
- 0Ag0;
- 5Cu;
- Solder thickness;
- Preparation direction;
- Damping;
- MECHANICAL-PROPERTIES;
- TEMPERATURE;
- DISLOCATION;
- CREEP;
52.Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads

机译：Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
- 作者：Supriyono;Chen Tzu-Chia;Yapanto Lis M.Latipov Zagir AzgarovichZekiy Angelina OlegovnaMelnikova Lyubov A.Thangavelu LakshmiSurendar A.Repnikov Nikolay I.Arzehgar Zeinab
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期
- Solder joints;
- Reliability;
- Electronic assembly;
- Vibration loading;
- SAC;
- VIBRATION RELIABILITY;
- SYSTEMS SUBJECT;
- BGA PACKAGES;
- PERFORMANCE;
- DEGRADATION;
53.Influence of the soldering paste type on optical and thermal parameters of LED modules

机译：Influence of the soldering paste type on optical and thermal parameters of LED modules
- 作者：Gorecki Krzysztof;Ptak Przemyslaw;Dziurdzia Barbara
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第4期
- Power LED module;
- Soldering pastes;
- Measurements;
- Optical parameters;
- Thermal parameters;
- PROFILE;
- JOINTS;
54.Mechanical testing and characterization of tin-zinc-antimony-lanthanum lead-free solders produced using mechanical alloying and furnace melting techniques

机译：Mechanical testing and characterization of tin-zinc-antimony-lanthanum lead-free solders produced using mechanical alloying and furnace melting techniques
- 作者：Sunderraj Arthur Jebastine D.;Ananthapadmanaban D.;Kathiresan Arun Vasantha Geethan
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第2期
- Lanthanum;
- Ball milling;
- Furnace melting;
- Lead-free soldering;
- Rare-earth element;
- Tin-zinc-antimony;
- RARE-EARTH;
- WEAR BEHAVIOR;
- MICROSTRUCTURE;
- ELEMENT;
55.The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs

机译：The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs
- 作者：Skwarek Agata;Ptak Przemyslaw Piotr;Gorecki KrzysztofWitek KrzysztofIlles Balazs
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第4期
- Power LEDs;
- Thermal resistance;
- ZnO;
- Optical efficiency;
- SACX composite alloys;
- Transient thermal impedance;
- Luminous efficiency;
- EVOLUTION;
- BEHAVIOR;
56.Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

机译：Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
- 作者：Ekpu Mathias
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第5期
- Pb-free;
- Sn-Ag-Cu;
- Finite element modelling (FEM);
- Thermal fatigue;
- Reliability;
- Fatigue life;
- Thermal interface materials;
- SAC solders;
- Modelling;
57.A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

机译：A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints
- 作者：Li Yanruoyue;Fu Guicui;Wan BoWu ZhaoxiYan XiaojunZhang Weifang
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第3期
- Lead-free;
- SAC305;
- Void formation;
- BGA;
- Modified MTTF equation;
- ELECTROMIGRATION;
- MICROSTRUCTURE;
- RELIABILITY;
- EVOLUTION;
58.Study of mechanical properties of indium-based solder alloys for cryogenic applications

机译：Study of mechanical properties of indium-based solder alloys for cryogenic applications
- 作者：Deshpande Madhuri Chandrashekhar;Chaudhari Rajesh;Narayanan RameshKale Harishwar
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第4期
- Indium solders;
- Mechanical properties;
- DBTT;
- SEM;
- Thermal cycling;
59.Experimental measurements of the shear force on surface mount components simulating the wave soldering process

机译：Experimental measurements of the shear force on surface mount components simulating the wave soldering process
- 作者：Carvalho Violeta;Arcipreste Bruno;Soares DelfimRibas LuisRodrigues NelsonTeixeira SenhorinhaTeixeira Jose C.
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期
- Experimental measurements;
- PCB;
- Shear force;
- Wave soldering;
- Surface mount technology;
- FLUID-STRUCTURE INTERACTION;
60.Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process

机译：Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process
- 作者：Ng Fei Chong;Abas Aizat;Nashrudin Muhammad NaqibTura Ali M. Yusuf
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第4期
- Flip-chips;
- Finite volume method;
- Underfill encapsulation;
- Electronic packaging;
- Voiding;
- FLOW;
61.Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

机译：Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
- 作者：Gan Guisheng;Chen Shiqi;Jiang LiujieJiang ZhaoqiLiu CongMa PengCheng DayongLiu Xin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第2期
- Shear strength;
- SAC0307;
- IMCs;
- Thermal aging;
- Ultrasonic-assisted;
- LEAD-FREE SOLDER;
- NANO-COMPOSITE SOLDERS;
- MECHANICAL-PROPERTIES;
- GRAPHENE NANOSHEETS;
- MICROSTRUCTURE;
- JOINTS;
- RELIABILITY;
- STRENGTH;
- IMPACT;
- SIZE;
62.Effect of different soldering temperatures on the properties of COB light source

机译：Effect of different soldering temperatures on the properties of COB light source
- 作者：Wang Zhao;Li Yuefeng;Zou JunYang BoboShi Mingming
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第2期
- Chip-on-board light source;
- Microstructure;
- Reliability;
- Soldering temperature;
- Vacuum reflow soldering;
63.Cu3Sn-microporous copper composite joint for high-temperature die-attach applications

机译：Cu3Sn-microporous copper composite joint for high-temperature die-attach applications
- 作者：Pan Zhen;Sun Fenglian
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第3期
- Shear strength;
- Aging;
- Electrical properties;
- Intermetallic alloys and compounds;
- Thermal properties;
- LEAD-FREE SOLDER;
- POWER;
- MICROSTRUCTURE;
- SN;
64.Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

机译：Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints
- 作者：Liu Yang;Xue Yuxiong;Zhou MinCao RongxingZeng XianghuaLi HongxiaZheng ShuZhang Shuang
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第3期
- SnBi;
- Sn-Ag-x;
- Solder;
- Leveling layer;
- Aging;
- SURFACE FINISH;
- RELIABILITY;
- CU;
- BEHAVIOR;
65.Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding

机译：Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding
- 作者：Sun F.;Pan Zhen;Liu YangLi XiangLiu HaoyuLi Wenpeng
- 期刊名称：《Soldering & Surface Mount Technology》 | 2021年第5期
- Intermetallic compounds;
- Microstructure;
- Solder joints;
- Growth kinetics;
66.Electronic component detection based on image sample generation

机译：Electronic component detection based on image sample generation
- 作者：Wu Hao;Lv Quanquan;Yang JiankangYan XiaodongXu Xiangrong
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期
67.Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys

机译：Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys
- 作者：Wang Zilong;Zhou JiaCheng;Liu FangWu YuqinYan Nu
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第2期
- Lead-free solder;
- Rotating magnetic field (RMF);
- Microstructure;
- Melting properties;
- Mechanical properties;
- SHORT-TERM STRESS;
- MECHANICAL-PROPERTIES;
- TEMPERATURE;
- ENHANCEMENT;
- RELAXATION;
- BEHAVIOR;
68.A review: effect of copper percentage solder alloy after laser soldering

机译：A review: effect of copper percentage solder alloy after laser soldering
- 作者：Abdullah Asyraf;Aisha Idris Siti Rabiatull
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第3期
69.Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

机译：Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted
- 作者：Gan Guisheng;Chen Shiqi;Jiang LiujieLiu CongHuang TianMa PengCheng DayongLiu Xin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第3期
- Shear strength;
- IMC;
- Ultrasonic;
- Low-temperature;
- Sn-0;
- 3Ag-0;
- 7Cu;
- Zn-particle;
- Cu5Zn8;
- NANO-COMPOSITE SOLDERS;
- MECHANICAL-PROPERTIES;
- MICROSTRUCTURE EVOLUTION;
- GRAPHENE NANOSHEETS;
- NANOPARTICLES SIZE;
- ALLOY;
- RELIABILITY;
- INTERFACE;
- BEHAVIOR;
- ENHANCEMENT;
70.Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

机译：Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys
- 作者：Kakitani Rafael;Pinto da Silva Cassio Augusto;Silva BismarckGarcia AmauriCheung NoeSpinelli Jose Eduardo
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期
- Microstructure;
- Solder;
- Solidification;
- Eutectic;
- Sn-Cu alloys;
- Sn-Bi alloys;
- IN-SITU;
- MICROSTRUCTURE EVOLUTION;
- PROCESSING PARAMETERS;
- ROD SPACINGS;
- GROWTH;
- MICROHARDNESS;
- PHASE;
- ZONE;
71.Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors

机译：Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors
- 作者：Straubinger Daniel;Toth Attila;Kerek ViktorCzeczei ZsoltSzabo AndrasGeczy Attila
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第4期
- Reflow soldering;
- Low standoff;
- SMD electrolytic capacitors;
- Solder ball;
- Solder bead;
- Capillary;
- LEAD-FREE SOLDER;
- REFLOW;
- PARAMETERS;
72.Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

机译：Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate
- 作者：Wang Xiuqi;Sun Fenglian;Han BangyaoCao YilunDu JinyangShao LongLiu Guohuai
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第2期
- Intermetallic compounds;
- Wetting;
- Flux;
- Lead-free;
- High temperature solder;
73.Parameter optimization for surface mounter using a self-alignment prediction model

机译：Parameter optimization for surface mounter using a self-alignment prediction model
- 作者：Mistry Maitri;Gupta Rahul;Jain SwatiVerma Jaiprakash V.Won Daehan
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第2期
- Surface-mount technology;
- Component self-alignment;
- Machine learning;
- Deep learning;
- Algorithm;
- Predictive analytics;
- PICK;
74.Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow

机译：Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow
- 作者：Heng Elwin;Abdullah Mohd Zulkifly
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第2期
- Moisture;
- Vapor pressure;
- Hydrophobic;
- Hydrophilic;
- Reflow process;
75.Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

机译：Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review
- 作者：Kamaruzzaman Lina Syazwana;Goh Yingxin
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第5期
- Lead-free solder;
- Tensile;
- Fracture mode;
- Shear strength;
- Hardness;
- Sn-Bi;
- LEAD-FREE SOLDER;
- TENSILE PROPERTIES;
- FRACTURE-BEHAVIOR;
- THERMAL FATIGUE;
- MICROSTRUCTURE;
- CU;
- TEMPERATURE;
- JOINTS;
- DEFORMATION;
- ADDITIONS;
76.Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

机译：Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder
- 作者：Zhai Xinmeng;Chen Yue;Li Yuefeng
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第3期
- Aging conditions;
- Ni-MWCNTs;
- Microstructure;
- Shear strength;
- Sn-Ag-Cu alloys;
- BEHAVIOR;
- CU6SN5;
77.Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

机译：Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process
- 作者：Han Xu;Li Xiaoyan;Yao Peng
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第2期
- Intermetallic compounds;
- Mechanism;
- Growth kinetics;
- Activation energy;
- Ultrasounds;
78.Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

机译：Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering
- 作者：Abdullah Muhammad Asyraf;Idris Siti Rabiatull Aisha
- 期刊名称：《Soldering & Surface Mount Technology》 | 2023年第4期
- Solder alloy;
- Shear strength;
- Laser soldering;
- Intermetallic compound;
- SHEAR-STRENGTH;
- INTERMETALLIC COMPOUNDS;
- POWDER-METALLURGY;
- FRACTURE-BEHAVIOR;
- LEAD;
- MICROSTRUCTURE;
- AG;
- WETTABILITY;
- MORPHOLOGY;
- TRANSITION;
79.Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model

机译：Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model
- 作者：Yin Yutian;Zhou Hongda;Chen CaiZheng YiShen HongqiaoGong Yubing
- 期刊名称：《Soldering & Surface Mount Technology》 | 2022年第1期

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