机译:Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions
Guilin Univ Elect Technol;
Sn58Bi; Sn3; 0Ag0; 5Cu; Solder thickness; Preparation direction; Damping; MECHANICAL-PROPERTIES; TEMPERATURE; DISLOCATION; CREEP;