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E-Beam Lithography Character and Stencil Co-Optimization

机译:电子束平版印刷特性和模板协同优化

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摘要

Electron-beam maskless lithography is being actively explored by the semiconductor industry for chip production in the sub-22 nm regime. Character projection allows in one e-beam shot the printing of complex pattern rather than merely a single rectangle or triangle as in variable-shaped beam projection. However, those circuit patterns that do not match any character on the stencil still have to be written by variable-shaped beam projection. We investigate a new problem of character and stencil co-optimization with blank space sharing between characters so as to minimize the total number of shots required for printing a circuit. We exploit the fact that the blank spaces on the sides of a character can be adjusted by moving the pattern to be printed within its projection region to facilitate blank space sharing so as to pack more characters into the stencil. Even though the co-optimization problem is shown to be NP-complete, we are able to design an elegant approximation algorithm, CASCO. Experiments confirm that the solutions by CASCO are nearly optimal. Compared to the published state-of-the-art, CASCO reduces the shot count by 1.59 times, while it is also orders of magnitude faster.
机译:半导体行业正在积极探索电子束无掩模光刻技术,以生产22nm以下的芯片。字符投影允许在一个电子束镜头中打印复杂的图案,而不是像可变形状的光束投影中那样仅打印单个矩形或三角形。但是,那些与模板上的任何字符都不匹配的电路图案仍然必须通过可变形状的束投影来写入。我们研究了一个新的字符和模板协同优化问题,其中字符之间有空白空间,以最大程度地减少印刷电路所需的总张数。我们利用这样一个事实,可以通过在要打印的图案的投影区域内移动要打印的图案来调整字符两侧的空白,以促进空白空间的共享,从而将更多的字符打包到模具中。即使协优化问题显示为NP完全,我们仍然能够设计一种优雅的近似算法CASCO。实验证实,CASCO的解决方案几乎是最佳的。与已发布的最新技术相比,CASCO的镜头数量减少了1.59倍,而且速度也提高了几个数量级。

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