陶瓷封装腔体内气体含量分析与控制

摘要

气密性封装技术应用广泛,内部水汽的含量能很好地控制在5 000×10-6以下。但在气密性封装器件的失效分析中发现,失效器件的某些失效与其内部除水汽之外的其他气氛含量异常有关,如锡基焊料焊接芯片长期贮存后抗剪/抗拉强度下降,与内部氧气含量高有关;银玻璃烧结的,长期贮存后抗剪/抗拉强度下降,与内部二氧化碳含量异常相关;内部氦含量高,则往往与返工处置不恰当相关,上述现象表明气密性封装中仅控制水汽含量是不够的。文章分析了腔体内氧气、二氧化碳、氦气的来源,气体含量异常与封装工艺的关系。同时在分析试验的基础上提出了针对性的工艺措施,试验结果表明这些改进措施能够很好地解决封装腔体内氧气、二氧化碳、氦气含量,并取得了期望的结果。%Hermetic package technology has been widely used in nowadays.There have been a lot of research on the vapor contents in electronic components sealed cavity.Internal vapor contents can be controlled in less than 5？000×10-6.But in the failure analysis about the hermetic package electronic components,we found that some failure about the components associated with other atmosphere contents anomaly in addition to other internal water vapor.For example,soldering alloy,shear strength and tensile strength will be reduced after a long-term storage,associated with the anomaly of internal oxygen contents.Silver glass sinter,shear strength and tensile strength will be reduced after a long-term storage,associated with the anomaly of internal carbon dioxide contents;The growth of the content in internal helium is often associated with inappropriate rework.These above phenomenons show that only controlling vapor contents was not enough for hermetic package.In this article,authors analyzed the relationship between the gas contents in the cavity anomaly with the mass of packaging,and the main reason caused the increase of oxygen,carbon dioxide and helium contents.At the same time,on the foundation of the analytical test,targeted technological measures is proposed.Experiments show that these improvement measures can solve the problem of oxygen,carbon dioxide and helium contents in the cavity smoothly,and obtain desired results.