大腔体陶瓷封装外壳断裂强度分析与提高

摘要

大尺寸多腔体陶瓷封装外壳，多用于高密度集成电路芯片封装，对结构可靠性提出了严格要求。在恒定加速度实验中，陶瓷封装外壳的腔体圆角处易形成断裂破坏。在有限元计算应力集中分布的基础上，通过分析激光划切、模具落腔和热切切腔加工工艺过程中产生缺陷的状态以及对陶瓷抗弯强度的影响，给出提高陶瓷封装外壳腔体断裂强度的方法。%The high reliability ceramic packagewith large size cavity, which is used for the high density IC packaging, has a strict requirement for the mechanical reliability. In the experiment of constant acceleration, the ceramic package is easily to be broken down at the cavity corner. Based on the distribution of stress concentration in finite element method, analysis the influence of laser processing and machining processing on the bending strength.Gives methods for improving the mechanical reliability of ceramic package cavity.