IC封装中键合线传输结构的仿真分析

摘要

With the development of the manufacturing process for the high-frequency and high-speed integrated circuit, the electronic package technology also have boarded a new height. As one of the microelectronic device manufacturing process, the interconnect structures in the package, such as vias, transmission lines and bonding wires, may have impacts on the performance of the circuit. So it is important to analyze the signal integrity in the advanced IC package design. A bonding wire interconnection transmission structure is presented in the paper, which is simulated by the full-wave analysis software. The impact of the key parameters, such as the material of bonding wire, the span of the bonding wire, the high arch of the bonding wire and the length of the microstrip, the width of the microstrip, were analyzed and summarized on the signal integrity of the package system. The simulation results provide a practical guide for the package design.%随着高频高速集成电路制造工艺的不断进步，电子封装技术的发展也登上了一个新高度。作为微电子器件制造过程中的重要步骤之一，封装中的传输线、过孔、键合线等互连结构都可能对电路的性能产生影响，因此先进的集成电路封装设计必须要进行信号完整性分析。介绍了一种键合线互连传输结构，采用全波分析软件对模型进行仿真，着重分析与总结了键合线材料、跨距、拱高以及微带线长度、宽度五种关键设计参数对封装系统中信号完整性的影响，仿真结果对封装设计具有实际的指导作用。