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International Journal of Microcircuits & Electronic Packaging

中文名称：国际微电路与电子包装杂志

ISSN：1063-1674
出版周期：Quarterly

发文量：348

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1.Michanical Cycling Fatigue of PBGA Package Interconnects

机译：PBGA封装互连的机械循环疲劳
- 作者：Larry Leicht
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Mechanical Bending Fatigue;
- Reliability;
- Plastic Ball Grid Array Package;
- Chip Scale Packaging.;
2.Manufacturing the Ti/Cu/Electroless Nickel Bump on Si

机译：在Si上制造Ti / Cu /化学镀镍凸块
- 作者：Kwang-Lung Lin;Jun-Wen Chen
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Electroless Process;
- Bumps;
- Bumps;
- Under Bump Metallurgy.;
3.How to Select Underfill Materials for Solder Bumped Flip Chips on Low Cost Substrates?

机译：如何为低成本衬底上的凸块倒装芯片选择底部填充材料？
- 作者：John H. Lau;Chris Chang
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Underfill;
- Flip Chip;
- PCB;
- Physical and Mechanical Properties.;
4.High Speed Power Dissipation Analysis of a GaAs Device

机译：GaAs器件的高速功耗分析
- 作者：Abdolreza Langari;Hassan Hashemi
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Thermal Transient;
- GaAs;
- Finite Element Analysis;
- MCM-L;
- Duty Cycle;
5.Package Quality Testing Using integrated Pressure Sensor

机译：使用集成压力传感器进行包装质量测试
- 作者：M.Waelti;N.Schneeberger;O.Paul
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Hermetic packaging;
- Leak Testing;
- MEMS;
- Quality Testing;
- Thermal Pressure Sensor;
6.Over-Temperature Predictions by a Transient R- C Model

机译：瞬态RC模型的温度过高预测
- 作者：Kun-Fu Tseng;Ting-Huan Chang;Ching-Hsing kao
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- R-C Circuit Model;
- Real Time Temperature Prediction;
- Transient Temperature Response;
7.Wirebonding:Reinventing the Process for MCMs

机译：引线键合：重塑MCM工艺
- 作者：H.K.Charles;Jr;K.J.Mach;R.L.Edwards
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Wirebonding;
- MCM Wirebond;
- Wirebond Testing;
- Wirebond Reli-;
8.Development of Ultra-Low Fire COG and X7R Dielectric Compositions for Multilayer Ceramic Chip capacitor and integrated Passive Component Applications

机译：用于多层陶瓷贴片电容器和集成无源元件应用的超低火COG和X7R介电组合物的开发
- 作者：Brian C. Foster;Walter J.Symes
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Uitra-Low Fire;
- Dielectric;
- Capacitor;
- Multilayer;
- Integration;
- and Electronic Packaging;
9.Development of 0.025mm Pitch Anisotropic Conductive Film

机译：0.025mm间距各向异性导电膜的研制
- 作者：Fuyuki Eriguchi;Masako Maeda;Fumiteru Asai
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Flip chip Interconnection;
- Fine Pitch;
- Linear Metal;
- Bump-Less;
- Thermoplastic polymer and Reliability.;
10.Microwave Characterization and Modeling of Multilayered Cofired Ceramic Waveguides

机译：多层共烧陶瓷波导的微波表征和建模
- 作者：Daniel Stevens;John Gipprich
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第1期
- Waveguide;
- W/G resonators;
- X-band;
- LTCC;
- EM Simulation.;
11.Calculation of Process Tolerance and Critical Length of Microstrip for High-Speed MCM Applications

机译：高速MCM应用的工艺公差和微带临界长度的计算
- 作者：Yungmin Lee
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- MCM;
- Interconnect;
- Characteristic Impedance;
12.A Low-Profile, High-Static Pressure Air Mover (A Reality with Brushless DC Planar Motor Technology)

机译：薄型，高静压空气移动器（采用无刷直流平面电动机技术的现实）
- 作者：Gary R. Keny;Dean L. Smith
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
13.Mechanical and Corrosion Properties of Aluminium Wires for Ultrasoic Bonding

机译：超声波焊接用铝线的机械和腐蚀性能
- 作者：Hongwei Liu;Nathan Fank;Caroline Acosta
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Wire;
- Ultrasonic Bonding;
- Mechanical Properties;
14.Low-Firing Lead magnesium Niobate-lead Tianate-Lead Germanium Silicate Ferroelectric Compositions for Thick Film Capacitor Applications

机译：用于厚膜电容器应用的低火铅铌酸铅镁天铅铅硅酸锗铁电组合物
- 作者：Yangdo Kim;Michael J. Haun
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Low-Firing;
- Thick-Film;
- Capacitor;
15.Electrical Characteristics of a Trial 1.5-mm Grid Multi-Pin Connector

机译：1.5mm网格多引脚试验连接器的电气特性
- 作者：Nobuaki Sugiura
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- 1.5-mm Grid;
- Multi-Pin Connector;
- Electrical Characteristics;
16.Design, Fabrication, and Qualification of Chip- On-Board Technology for Space electronics

机译：航天电子板上芯片技术的设计，制造和鉴定
- 作者：Binh Q. Le;Richard H. Maurer;Elbert Nhan
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Chip-on-Board(COB);
- Direct Chip Attach (DCA);
- Electronic Miniaturization;
17.Modeling the Effect of Microstructure in BGA Joints

机译：模拟BGA接头中微结构的影响
- 作者：S.J. Holden;E.R. Wallach
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- BGA;
- Finite Elment Analysis;
- Microstructure;
18.The Role of Case-Rigidity in Drop-Tolerance of Portable Products

机译：刚性在便携式产品耐跌落中的作用
- 作者：Suresh Goyal;Sanjay Upasani;Dhiren M. Patel
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Impact;
- Survivability;
- Forces;
19.Breakdown Verification for Fault Transients in Laminate Microstrip Conductors

机译：层压微带导体中故障瞬态的击穿验证
- 作者：Joel Jorgenson;Marwan Hassoun;Hsiu Han
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Corona;
- Dielectric Breakdown;
- and Fine Pitch Interconnect;
20.Modeling and Metrology for Expedient Analysis and design of computer Systems

机译：方便的计算机系统分析和设计的建模与计量
- 作者：Cullen Bash;Chandrakant Patel
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Compact Modeling;
- Thermal Design;
- System Analysis;
21.Micro-ball Bumping Technology for Flip Chip and TAB Interconnections

机译：倒装芯片和TAB互连的微球碰撞技术
- 作者：K. Tatsumi;K. Shimokawa;E. Hashino
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Flip Chip;
- TAB;
- Bumping;
22.The Optimal Passive Thermal Management Soldering and Electrically-Isolating Power Semiconductors to Within 33-micron (1.3 mil) of The Heat Sink

机译：最佳无源热管理焊接和电隔离功率半导体，散热片的距离不超过33微米（130万密耳）
- 作者：Jim Fraivillig
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Thermal Management;
- cooling Technique;
- Thermal Resistance;
23.The Effect of Flux on the Wetting of Autocatalytic Ni-Cu-P by In-Sn Solder

机译：助焊剂对In-Sn焊料润湿自催化Ni-Cu-P的影响
- 作者：Kwang-Lung Lin;Chun-jen Chen
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Flux;
- Wetting;
- and Solder;
24.Photolithography Applications for Evaporative, Plated, and Printed Wafer Bumping Interconnect Technologies

机译：蒸发，镀覆和印刷晶圆凸点互连技术的光刻应用
- 作者：Christopher W. Argento;Todd M. Flynn
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Wafer Bumping;
- Photolithography;
- Electroless Plating;
25.Optimizing the Integration of an Electronics System into an Existing Enclosure Using CFD Modeling Techniques

机译：使用CFD建模技术优化将电子系统集成到现有机柜中
- 作者：David Lober
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第2期
- Computational Fluid Dynamics;
- Thermal Modeling;
- System Level analysis;
26.Finite Element Analysis of the Residual Thermal Stresses in a Power Package with Two Different

机译：两种不同功率封装中残余热应力的有限元分析
- 作者：W.D.Zhuang
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Residual Thermal Stresses;
- Thermal Fatigue;
- Finite Element;
27.Distributed Microwave MCM-D Circuits for X- and K-Band Applications

机译：适用于X波段和K波段应用的分布式微波MCM-D电路
- 作者：Philip Pieters;Steven Brebels;Walter De Raedt;Eric Beyne
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- MCM-D;
- Multilayer Microwave Circuits;
- Lange Coupler;
- Broad-band Coupler;
- and Balun.;
28.Manufacturability Issues in Flip Chip on Laminate Assembly

机译：层压板组件上倒装芯片的可制造性问题
- 作者：Jing Qi;R. Wayne Johnson
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Flip Chip;
- Underfill;
- Manufacturing;
- Reliability.;
29.Room Temperature Ultrasonic Wirebonding with Large Diameter Copper Wire

机译：大直径铜线室温超声引线键合
- 作者：Joseph Fauty;Jay Yoder
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Wirebonding and Large Diameter Copper Wire;
30.VA/PLANE Rapidproto: Custom Chip Carrier for Prototyping High-Speed Mixed Signal Integrated Circuits

机译：VA / PLANE Rapidproto：用于高速混合信号集成电路原型的定制芯片载体
- 作者：B.K.Oyama;S.W.Southwell
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- High Frequency characterization;
- Ceramic Chip Carrier;
- Mixed;
31.Thermosonic Gold wirebonding to Electrolessly- Metallized Copper Bondpads over Benzocyclobutene

机译：将热超声金丝键合到苯并环丁烯上的化学镀金属铜焊盘上
- 作者：Richard Ulrich;Mohammed Wasef
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Wirebonding;
- Benzocyxlobutene;
- BCB;
- CYCLOTENE(tm);
32.Substrate Requirements for Effective Integration of Chip Scale Packages and Multichip Modules in Portable Wireless Products

机译：有效集成便携式无线产品中的芯片级封装和多芯片模块的基板要求
- 作者：Tom Swirbel;Motorola
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Portable;
- Wireless;
- Substrates;
- Chip Scale Packages;
- and Multichip Modules.;
33.Heat Affected Zone in the Wire Electrode During Electronic Flame off in Bonding

机译：键合中电子熄火过程中线电极中的热影响区
- 作者：Srinivas S. Sripada;I.M.Cohen;P.S.Ayyaswamy
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Fine pitch ball-bonding;
- Electronic Flame Off (EFO);
- Heat af-;
34.Challenges in the Packaging of MEMS

机译：MEMS封装中的挑战
- 作者：Ajay P.Malshe;Chad ONeal;Sushila B.Singh
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Microelectromechanical Systems (MEMS), Electronic Packaging;
- Fabrication Processes;
35.Moire Interferometer, An Effective Tool in Electronic Packaging, Concept and Applications

机译：莫尔干涉仪，电子封装，概念和应用中的有效工具
- 作者：Daping Zou;Minfu Lu;Ling Shi
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Moire Interferometer;
- Shear Strain;
- Coefficient of Thermal Expan-;
36.Laser Testing of MCM-D Structures

机译：MCM-D结构的激光测试
- 作者：Deborah M. Mechtel;U.S. Naval Academy
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Non-invasive Testing;
- Polyimide;
- Multichip Modules;
- Electro-Optic.;
37.Quantifying the Impact of a Non-ideal Return Path

机译：量化非理想返回路径的影响
- 作者：Andrew Byers;Melinda Piket-may
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Signal Integrity;
- Timing Budget;
- Coupling;
- Return Current Path;
- Finite Difference Time Domain;
- Time Domain Reflectometry;
38.Passive integration Process on Standard and High Resistivity Silicon

机译：标准和高电阻率硅上的被动集成工艺
- 作者：H.Kattelus;H.Ronkainen;T.Riihisaari
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第3期
- Passive Integration;
- Thin Film Resistors;
- Tantalum Oxide;
- Hafnium Oxide;
- Integrated inductors;
39.Biaxial Strength, Strength-Size-Scaling, and Fatigue Resistance of Alumina and Aluminum Nitride Substrates

机译：氧化铝和氮化铝基板的双轴强度，强度尺寸缩放和抗疲劳性
- 作者：A.A.wereszczak;T.P.Kirkland;K.Breder
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Ceramic Substrates;
- ain;
- AI_2O_3;
- Strength;
- Fatigue;
- weibull Distribution;
40.Analyzing Thick Film Multilayer Defects Using Acoustic Micro Imaging

机译：使用声学显微成像分析厚膜多层缺陷
- 作者：G. Harsanyi;J.E. Semmens;S.R.Martell
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Acoustic Micro Imaging;
- Nondestructive Analysis;
- High Tem-;
41.A Study of Underfill Dispensing Process

机译：底部填充胶分配过程的研究
- 作者：Y.C.Chia;S.H.Lim;K.S. Chian
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Underfill Dispensing Process;
- Flip Chips;
- C-SAM;
- Reliabil-ity;
42.A New 16x16 ATM Switching Multichip Module With High Performance

机译：新型高性能16x16 ATM交换多芯片模块
- 作者：Youngmin Lee;Dong-Eun Chung;Sang-Pok
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Multichip Modules;
- ATM Switch Module;
- MCM-D;
- Thermal;
43.Ceramic BGA Reliability Versus Board Side Solder Volume

机译：陶瓷BGA可靠性与电路板侧焊体积
- 作者：T.Burnette;T.Koschmieder;W. Oyler
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- BGA Reliability;
- Soledr Joint Reliability;
- Board Attachment;
44.Generation of Testability on high Density/Speed ATM MCM and its Library Build-Up Using BCB Thin Film Substrate

机译：使用BCB薄膜基板在高密度/高速ATM MCM上产生可测试性并建立其库
- 作者：Jun-Hwan woo;Seung-Gon Kim;Sung-Gun Ji
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- High Speed Data Processing;
- rocessing;
- High Density Circuit Integration;
- MTM;
- GpS;
45.Characteristics and Reliability of No-Flow Underfills for Solder Bumped Flip Chip Assemblies

机译：焊锡倒装芯片组件的无流动底部填充材料的特性和可靠性
- 作者：John H. Lau;Chris Chang;Chih-chiang chen
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- No-floe Underfill;
- Flip Chip;
- Reliability;
- Physical and Mechanical Properties.;
46.Pre-Develop Bake for Eng point Stabilization with Photo-BCB Polymers

机译：使用Photo-BCB聚合物进行预开发烘烤以稳定Eng点
- 作者：D.Scheck;M.Dibbs;S.Cummings;P.Garrou
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Benzocyclobutene;
- BCB;
- rocessing;
- Photo-BCB;
- Cyclotene Develop;
- Photolithography.;
47.Partitioning of Water between Voids and the Polymer Matrix in a Molymer Compound by Proton NMR: The Role of Larger Voids in the Phenomena Of Popcorning and Delamination

机译：质子核磁共振在高分子化合物中的空隙与聚合物基质之间的水分配：爆裂和分层现象中较大空隙的作用
- 作者：D.L.VanderHart;M.A.Schen
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Molding Compound;
- Void Content;
- Popcorning;
- Delamination;
- NMR;
- Proton;
- Partitioning;
48.Modeling a Low Cost Wafer Bumping Technique for Flip Chip Application

机译：为倒装芯片应用建模低成本的晶圆凸点技术
- 作者：Tennyson A. Nguty;Ndy. N.Ekere;Electronics Manufacture
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Flip Chip;
- Sloder Bump Volume;
- Solder Bump Height;
- Solder;
49.Thermal Stress induced Failures in Adhesive Flip Chip Joints

机译：热应力引起的倒装芯片接头失效
- 作者：Outi Rusanen;Jaakko Lenkkeri
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Flip Chip Bonding;
- Isotropically Conductive Adhesives;
- Ther-mal Stress;
- Reliability.;
50.The Effect of Polyimide Passivation on the Electromigration in Sputtered Copper Films

机译：聚酰亚胺钝化对溅射铜膜中电迁移的影响
- 作者：Jiann-Shan Jiang;Bi-Shiou Chiou
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Electromigration;
- Polyimide Passivation;
- Sputtered Copper Films;
51.MCM-D/C Yield improvements Through Effective Diagnostics

机译：通过有效的诊断提高MCM-D / C的产量
- 作者：Eric D.Perfecto;Kamalesh S.Desai;Gragham McAfee
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- MCM-D;
- MCM-D/C;
- Manufacturing;
- Defect partitioning;
- Yield;
52.Time-Domain Current Waveform Simulation for CMOS VLSL Circuits Using Charge-Based Model

机译：基于电荷模型的CMOS VLSL电路时域电流波形仿真
- 作者：Jyh-Herng Wang;Faraday Technology Corp
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Time domain simulation;
- CMOS;
- Charge Based;
- Timing;
53.Thermo-Mechanical Design of Microelectronic Packages Through Design-of-Simulations Methodology

机译：通过模拟设计方法进行微电子封装的热机械设计
- 作者：Manjula N. Variyam;Suresh K. Sitaraman
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 1999年第4期
- Design-of-Simulations;
- Thermo-Mechanical;
- Reliability;
- Electronic Packaging.;
54.Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis

机译：包括冷却失效分析的新型密闭冷却方案的热性能评估
- 作者：Manasa Sahini;Dereje Agonafer
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第1期
55.An Electronic Packaging Approach to Improving an Environmental Sensor and Sensing Technique

机译：一种改善环境传感器和传感技术的电子封装方法
- 作者：Robert N. Dean;Rebecca E. Dean
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第1期
- Electrical conductivity;
- electronic packaging;
- environmental;
- sensor;
56.Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications

机译：高温应用中金属间Cu-Sn互连的热稳定性
- 作者：A. Novikov;M. Nowottnick
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第1期
- Intermetallic phase;
- composite solder material;
- remelting temperature;
57.Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

机译：从焊锡表面张力模型得出的多芯片模块平面度要求
- 作者：Thomas F. Marinis;Joseph W. Soucy
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第1期
- Multichip module;
- fan-out packaging;
- substrate warpage;
- solder bump;
- surface tension;
58.High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0-300℃]

机译：宽温度范围[0-300℃]的高精度混合信号传感器接口
- 作者：Georg Gläser;Dagmar Kirsten;André Richter;Marco Reinhard;Gerrit Kropp;Dirk M. Nuernbergk
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第1期
59.LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

机译：基于LTCC的高度集成SiPM模块，具有集成的液体冷却通道，用于高分辨率分子成像
- 作者：Rainer Dohle;Ilaria Sacco;Thomas Rittweg;Thomas Friedrich;Gerold Henning;Jörg Goßler;Peter Fischer
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第2期
- LTCC;
- liquid cooling;
- thermal management;
- PET/MRI;
- SiPM;
60.Equivalent Capacitance Approach to Calculate Effective Roughness Dielectric Parameters for Copper Foils on Printed Circuit Boards

机译：等效电容法计算印刷电路板上铜箔的有效粗糙度介电参数
- 作者：Marina Y. Koledintseva;Tracey Vincent
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第2期
61.Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

机译：纳米压痕法表征玻璃/环氧编织基板的力学性能和蠕变行为
- 作者：Abel Misrak;Luu Nguyen;Steven Kummerl;Dereje Agonafer
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第2期
- Nanoindentation;
- printed circuit boards;
- reliability;
- atomic force microscopy;
- viscoelasticity;
- creep test;
62.Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al_2O_3/K_2O_3–B_2O_3–SiO_2 Composite Ceramics for LTCC Applications

机译：用于LTCC的Ca掺杂Al_2O_3 / K_2O_3–B_2O_3–SiO_2复合陶瓷的低温共烧和介电性能
- 作者：Zhe Song;Joanna Chu;Kun Huang;Lasse Norén;Zhenxiao Fu;Yun Liu
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第2期
- LTCC materials;
- borosilicates;
- dielectric properties;
- LTCC process compatibility;
63.Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging-A Critical Review

机译：微电子封装中的热界面材料和冷却技术-综述
- 作者：Dinesh P. R. Thanu;Boxi Liu;Marco Aurelio Cartas
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第2期
- Adhesion;
- cooling solution;
- integrated heat spreader;
- microelectronic packaging;
- thermal interface material;
64.Dark Current Leakage in Optoelectronic Hermetic Packages

机译：光电密封封装中的暗电流泄漏
- 作者：Clara Dionet;Goran Perosevic;Jeff Javier;Sammie Fernandez;Taylor Hurdle;Maziar Moradi;Andrew Neely;Kevin Ma;Marwan Albarghouti
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2018年第2期
- Dark current;
- hermetic;
- optoelectronics;
- photodetector;
- polyimide;
65.Development of a Stress Compensation Layer for 3-D Assembly of Thin Pixel Modules

机译：开发用于薄像素模块的3D组装的应力补偿层
- 作者：G. Pares;T. McMullen;S. Tome;L. Vignoud;R. Bates;C. Buttar
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
- Pixel detector;
- stress layer compensation;
- thin chip;
- warp management;
66.Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process

机译：陶瓷包装制造过程中氧化铝生带的形状加工产生的热切割缺陷的特征
- 作者：Chao Zeng;Chunqing Wang;Yanhong Tian;Chunjin Hang;Wei Liu;Rong An
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
- Hot-cutting defect;
- variance analysis;
- ceramic packaging;
67.Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology

机译：大气等离子技术对纤维增强塑料涂覆的铜电路路径的电气和机械研究
- 作者：Rene Schramm;Thomas Reitberger;Joerg Franks
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
- Additive metallization;
- atmospheric plasma coating;
- characterization;
- plastics;
68.Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled Environment

机译：受控环境中浴液稳定性对TSV电镀铜的影响
- 作者：Anh Nguyen;Kevin Fealey;Peter Reilly;Gyanaranjan Pattanaik;Alison Gracias;Fred Wafula;Michael Flynn;Jack Enloe
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
- 3-D IC;
- electroplating bath life;
- electroplating bath stability;
- electroplated Cu;
- through-silicon via;
- TSV;
69.A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices

机译：硅微流体器件的可密封，气密性包装技术
- 作者：Lilla Safford Smith;Gordon D. Hoople;Jim C. Cheng;Albert P. Pisano
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
- Hermetic bonding;
- microfluidic packaging;
- cooling;
- electronics cooling;
- microloop heat pipe;
70.Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth

机译：熔点较低的含铋无铅合金的生产性和可靠性筛选
- 作者：Joseph M. Juarez Jr.;Polina Snugovsky;Eva Kosiba;Zohreh Bagheri;Subramaniam Suthakaran;Michael Robinson;Joel Heebink;Jeffrey Kennedy;Marianne Romansky
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
71.Radio Frequency Microelectromechanical System-Platform Based on Silicon-Ceramic Composite Substrates

机译：基于硅陶瓷复合衬底的射频微机电系统平台
- 作者：M. Fischer;S. Gropp;J. Nowak;B. Capraro;R. Sommer;M. Hoffmann;J. Mueller
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第1期
- RF-MEMS platform;
- SiCer;
- silicon-on-ceramic;
- LTCC;
- DRIE;
72.Reliability Assessment of Flip-Chip Assembly of Al Bumps

机译：铝凸点倒装芯片装配的可靠性评估
- 作者：Hidekazu Tanisawa;Kohei Hiyama;Takeshi Anzai;Hiroki Takahashi;Yoshinori Murakami;Shinji Sato;Kinuyo Watanabe;Fumiki Kato;Hiroshi Sato
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Al wire;
- bump;
- flip-chip;
- SiC;
- recrystallization;
73.Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology

机译：使用具有堆叠式硅互连技术的28-nm FPGA实现可制造的3-D技术和生态系统
- 作者：Woon-Seong Kwon;Myongseob Kim;Jonathan Chang;Suresh Ramalingam;Liam Madden;Genie Tsai;Stephen Tseng;J.Y. Lai;Terren Lu;Steve Chiu
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Interposer;
- stacked silicon interconnect technology;
- manufacturing yield;
- warpage;
- microjoining;
74.Laser Ablation of Thin Films on Low Temperature Cofired Ceramic

机译：低温共烧陶瓷上薄膜的激光烧蚀
- 作者：M. A. Girardi;K. A. Peterson;P. T. Vianco;R. Grondin;D. Wieliczka
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Ablation;
- laser;
- LTCC;
- thin film;
75.Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires

机译：工艺参数对铜和镀钯铜键合线中空气球完整性的影响
- 作者：Noritoshi Araki;Yasutomo Ichiyama;Ryo Oishi;Teruo Haibara;Takashi Yamada
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Copper wire;
- EFO parameters;
- free air ball;
- palladium-coated copper wire;
- wire bonding;
76.The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu Films

机译：氢气逸出对化学镀铜膜中气泡形成的影响
- 作者：Tobias Bernhard;Frank Bruening;Ralf Bruiting;Tanu Sharma;Delilah Brown;Sebastian Zarwell;Craig Bishop
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Delamination failure;
- electroless Cu;
- hydrogen evolution;
- internal stress;
77.Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process

机译：嵌入式模具封装中组装过程中不同应力和挠度分析方法的比较
- 作者：K. Macurova;R. Bermejo;M. Pletz;R. Schoengrundner;T. Antretter;T. Krivec;M. Morianz;M. Brizoux;A. Lecavelier
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Assembly process;
- residual stress;
- warpage;
- classical laminate theory;
- interfacial model;
- FEA;
78.Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly

机译：在未上漆的PWB组件翘曲测量过程中自动分割PBGA封装和PWB区域的自动分割方法
- 作者：Sungbum Kang;I. Charles Ume
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第2期
- Digital fringe projection;
- warpage;
- segmentation;
- printed wiring board assembly;
- surface painting;
79.New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGA

机译：适用于高性能和低成本FPGA的新型堆叠式芯片互连技术
- 作者：Woon-Seong Kwon;Suresh Ramalingam;Xin Wu;Liam Madden;C. Y. Huang;Hung-Hsien Chang;Chi-Hsin Chiu;Steve Chiu;Stephen Chen
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- 2.5D Technology;
- silicon-less interconnect technology;
- cost effective;
- warpage;
80.High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration

机译：直接在通过Si孔填充的Cu上制造的100μm以下Alpha低SAC105焊球的高剪切速度特性进行3D集成
- 作者：Do Hyun Jung;Shalu Agarwal;Santosh Kumar;Jae Pil Jung
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- Through Si via;
- low alpha solder;
- soft error;
- electroplating;
- high-speed shear test;
81.Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects

机译：晶粒结构和材料特性对3D互连中的过孔挤压的影响
- 作者：Tengfei Jiang;Chenglin Wu;Jay Im;Rui Huang;Paul S. Ho
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- 3D integration;
- via extrusion;
- microstructure;
- FEA;
- interface;
82.Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates

机译：用于制造导热板的粘结陶瓷-金属层
- 作者：Madhav Datta
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
83.Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices

机译：SiC功率半导体器件的高温夹层结构功率模块的翘曲评估
- 作者：Takeshi Anzai;Yoshinori Murakami;Shinji Sato;Hidekazu Tanisawa;Kohei Hiyama;Hiroki Takahashi;Fumiki Kato;Hiroshi Sato
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- SiC;
- high temperature;
- warpage;
- power module;
- Si_3N_4 substrate;
- baseplate;
84.Challenges of Scalable 2.5D IC Assembly

机译：可扩展的2.5D IC组装面临的挑战
- 作者：Liang Wang;Charles G. Woychik;Guilian Gao;Grant Villavicencio;Scott McGrath;Hong Shen;Sitaram Arkalgud
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- Assembly;
- 2.5D IC;
- interconnect;
- warpage control;
85.Design Considerations of High-Current Density Capacitors Micromachined for Si Interposers

机译：用于硅中介层的微加工高电流密度电容器的设计考虑
- 作者：A. N. Beal;J. Tatarchuck;C. B. Stevens;T. A. Baginski;M. C. Hamilton;R. N. Dean
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- MEMS;
- capacitor;
- interposer;
86.Packaging Design and Assembly for Ultrahigh Energy Density Microbatteries

机译：超高能量密度微电池的包装设计和组装
- 作者：Caroline K. Bjune;Thomas F. Marinis;Yet-Ming Chiang
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第3期
- Microbatteries;
- lithium ion;
- high energy density;
- indium epoxy;
- anodized aluminum;
87.Development of a Multifunctional Implantable Heart Monitoring Device

机译：多功能植入式心脏监护仪的研制
- 作者：Anh-Tuan T. Nguyen;Fjodors Tjulkins;Knut E. Aasmundtveit;Nils Hoivik;Lars Hoff;Ole-Johannes Grymyr;Per Steinar Halvorsen;Kristin Imenes
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
- Three-axis MEMS accelerometer;
- myocardial ischemia;
- open thorax surgery;
- closed thorax;
- heart muscle;
- pacing;
- implantable accelerometer device;
88.Process Optimization for 3-D IC Assembly

机译：3-D IC组装的工艺优化
- 作者：Charles G. Woychik;Sangil Lee;Scott McGrath;Sitaram Arkalgud
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
- 2.5-D;
- 3-D IC;
- TSV;
- microbumped die;
- Si interposer;
- CTE;
- warpage;
- JEDEC reliability specifications;
- chip stacking;
89.High-Temperature Anisotropic Magnetoresistive (AMR) Sensors

机译：高温各向异性磁阻（AMR）传感器
- 作者：Bharat B. Pant;Lucky Withanawasam;Mike Bohlinger;Mark Larson;Bruce W. Ohme
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
- High-temperature magnetic sensors;
- AMR sensors;
90.Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics

机译：低温光电设备，包装和材料的评论
- 作者：Eivind Bardalen;Muhammad Nadeem Akram;Helge Malmbekk;Per Ohlckers
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
91.Fabrication and Characterization of Vibration and Wind Energy Harvesters Using Multilayer Free-Standing Piezoelectric Thick Films

机译：多层自由站立压电厚膜的振动和风能收集器的制造与表征
- 作者：Yang Bai;Hana Hughes;Pavel Tofel;Carl Meggs;Tim W. Button
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
- Piezoelectric;
- energy harvesting;
- vibration;
- wind;
- thick film;
- free-standing;
92.High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds

机译：含硫化合物的模塑料包封的铜线封装的高温可靠性
- 作者：Varughese Mathew;Sheila Chopin
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
- Copper wire bond;
- mold compounds;
- high temperature reliability;
- corrosion;
- electronic package;
93.Temperature Dependence of High Dielectric Strength Potting Materials for Medium Voltage Power Modules

机译：中压功率模块的高介电强度灌封材料的温度依赖性
- 作者：Chad B. ONeal;Matthew Feurtado;Jennifer Stabach;Ty McNutt;Brandon Passmore
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2015年第4期
- Dielectric testing;
- medium voltage modules;
- high temperature electronics;
94.Redistribution Layers (RDLs) for 2.5D/3D IC Integration

机译：用于2.5D / 3D IC集成的重新分配层（RDL）
- 作者：J. Lau;P. Tzeng;C. Lee;C. Zhan;M. Li;J. Cline;K. Saito;Y. Hsin;P. Chang;Y. Chang;J. Chen;S. Chen;C. Wu;H. Chang;C. Chien;C. Lin;T. Ku;R. Lo;M. Kao
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期
- 3D IC integration;
- through-silicon via (TSV);
- redistribution layer (RDL);
- polymer;
- Cu damascene;
95.Reliability of SiC Digital Telemetry Circuits on A1N Substrate

机译：AlN衬底上SiC数字遥测电路的可靠性
- 作者：Reza Ghandi;Cheng-Po Chen;Liang Yin;Rich Saia;Tammy Johnson;Peter Sandvik;Kun Fang;R. Wayne Johnson
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期
- Silicon carbide;
- digital telemetry;
- geothermal;
- MOSFETs;
96.Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates

机译：铜图案密度和取向对BGA基板模量的影响
- 作者：Burton Carpenter;Betty Yeung;Yuan Yuan
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期
- Elastic modulus;
- flex modulus;
- homogenization rules;
- metal density;
- metal pattern;
- substrate;
97.Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion(SLID) Bonding

机译：晶圆级Cu-Sn固液互扩散（SLID）键的空隙形成和键强度的研究
- 作者：Astrid-Sofie B. Vardoy;H. J. van de Wiel;Stian Martinsen;Greg R. Hayes;Hartmut R. Fischer;Knut E. Aasmundtveit;Adriana Lapadatu;Maaike M. V. Taklo
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期
- Voids;
- shear strength;
- robustness;
- hermetic wafer level bonding;
- solid-liquid interdiffusion (SLID);
- Cu-Sn;
98.LT-TLPS Die Attach for High Temperature Electronic Packaging

机译：LT-TLPS模具附件，用于高温电子包装
- 作者：Hannes Greve;F. Patrick McCluskey
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期
- Transient liquid phase sintering;
- lead free solder;
- die attach;
- power electronics;
- high temperature electronics;
99.Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures

机译：高温封装式压力传感器的机械应力分析
- 作者：Roderich Zeiser;Suleman Ayub;Jochen Hempel;Michael Bemdt;Juergen Wilde
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期
- Digital image correlation (DIC);
- high temperature;
- packaging stress;
- pressure sensor;
- strain gauges;
100.Ultra Low Weight Spacer for PCB to PCB Interconnections

机译：超低重量垫片，用于PCB至PCB的互连
- 作者：Luca Petricca;Per Ohlckers;Geir Morten Mellem
- 期刊名称：《International Journal of Microcircuits & Electronic Packaging》 | 2014年第1期

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