Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Reassembly) - (PPT)

摘要

GCI's Extraction Capability is Proven and Reliable, Standard High-Temperature Packaging Increases Life Times by More Than 250x (for Applications > 185C), Ni/Au or Ni/Pd/Au Pad Reconditioning Increases Life Times by More than 1000x (for Applications > 185C), Ni/Au or Ni/Pd/Au Pad Reconditioning Allows for Conventional Assembly While Maintaining Hi-Temp Reliability!