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High-temperature pulse brazing-welding for electron component mounting on printed-circuit boards

机译:用于印刷电路板上的电子元件的高温脉冲钎焊焊接

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The main task of this technology is the development of reliable heat resistant joints on printed circuit boards. The base of technology is spot electrostatic welding-soldering with energy inserting by a special algorithm. (Figures 1,2) Welding head electrodes (3) hold down, with a specified pressure P, electron component lead (2) to a land (5) of a printed circuit board (1). Electrostatic electrode discharge (5) takes place with an energy inserting by a specified algorithm, at the same time an optimal welding-soldering regime is sustained automatically within given limits at the expense of consistant monitoring of energy amount inserted into a joint energy.
机译:该技术的主要任务是在印刷电路板上开发可靠的耐热接头。技术基准是点静电焊接焊接,具有特殊算法的能量插入。 (图1,2)焊接头电极(3)按住,用指定的压力P,电子部件引线(2)到印刷电路板(1)的焊盘(5)。静电电极放电(5)通过指定算法的能量插入进行,同时在给定限度内自动地保持最佳焊接状态,以牺牲插入到关节能量的能量量的一致性监测。

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