Signal Integrity Analysis Techniques used to Characterize PCB Substrates

摘要

The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuitrnboards. The loss tangent is the electrical property used by material suppliers to characterize the signal integrity of the PCBrnsubstrate. OEMs will perform additional electrical tests to characterize the performance of a PCB substrate before deciding tornapprove it for use in a design. This paper will discuss one technique used to characterize signal integrity by an OEM.rnAdditionally, this test will be compared to values provided by material suppliers to determine the degree of correlation.