The continued functional densification and integration in networking products is driving the need to study large form factorrnprinted circuit boards that use high I/O packages (either ceramics column grid arrays, CCGA, or plastic ball grid array,rnPBGA). As of today, there has been limited work on understanding the impact of lead-free soldering on these large andrncomplex assemblies. This paper will look at larger packages (up to 52.5mm square with 2577 I/O) in combination withrnlead-free soldering. Assembly processes such as solder paste printing and reflow soldering will be studied and the resultsrnpresented. The rework of these component types will be evaluated and the key issues for developing a successful reworkrnprocess will be discussed.
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机译:网络产品中功能的不断致密化和集成,促使人们需要研究使用高I / O封装(陶瓷列栅阵列,CCGA或塑料球栅阵列,rnPBGA)的大尺寸印刷电路板。到目前为止,了解无铅焊接对这些大型复杂复合体的影响的工作还很有限。本文将结合无铅焊接研究更大的封装(最大22.5 I / O的52.5mm正方形)。将研究锡膏印刷和回流焊接等组装过程,并展示结果。将评估这些组件类型的返工,并讨论开发成功的返工过程的关键问题。
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