Design and Development of a High Performance Wirebond BGA Package

摘要

As the need for higher performance, higher I/O count packaging solutions at lower costs continues to grow, opportunitiesrnexist to support these applications with higher performance wire bonded packages, as an alternative to some of the morernexpensive FlipChip solutions.rnThis paper details the unique design layout and engineering development methodologies that were used to produce a familyrnof organic wire bonded BGA packages. This family of packages utilizes a ‘Stripline' cross-sectional structure in contrast tornthe more commonly used ‘Microstrip' structure for electrical enhancement. This enhancement is combined with the packagerndesigned to support both ‘Single ended' and ‘Differential' I/O's as well as providing support for multiple I/O voltages. Inrnsupporting the need for increased power dissipation, built in heat spreaders as well as optimized thermal via and solderballrnlayouts have been designed into the package.rnThe packages are able to support a high density of I/O's per unit area of the die, by combining an optimal layout of multiplernrows of bonding pads on the die with a package layout that promotes the electrical enhancement features. Our modeling andrncharacterization of this family of packages conclude it meets the high performance requirements needed of the nextrngeneration electronic packages.