New applications of in-plane, shadow, and reflection moire methods,

摘要

Abstract: This paper describes some recent applications of the classical moire methods. The first is the use of in-plane moire method to monitor crack tip strain during cyclic loading. A new model predicting the crack growth rate using crack tip strain as a parameter is proposed. The second is the development of a modified shadow moire method for mapping warpage of silicon wafers due to the presence of residual stress. Talbot effect is introduced to enhance the sensitivity of the shadow moire method. The third example is the use of a modified reflection moire method to monitor the quality of thin films deposited on substrates. !24