New applications of in-plane shadow and reflection moire methods

摘要

Abstract: This paper describes some recent applications of theclassical moire methods. The first is the use ofin-plane moire method to monitor crack tip strainduring cyclic loading. A new model predicting the crackgrowth rate using crack tip strain as a parameter isproposed. The second is the development of a modifiedshadow moire method for mapping warpage of siliconwafers due to the presence of residual stress. Talboteffect is introduced to enhance the sensitivity of theshadow moire method. The third example is the use of amodified reflection moire method to monitor the qualityof thin films deposited on substrates. !24