首页> 外国专利> PROCESS FOR MANUFACTURING A COMPOSITE STRUCTURE INCLUDING A THIN SIC MONOCRISTALLINE SIC LAYER ON A SIC SUPPORT SUBSTRATE

PROCESS FOR MANUFACTURING A COMPOSITE STRUCTURE INCLUDING A THIN SIC MONOCRISTALLINE SIC LAYER ON A SIC SUPPORT SUBSTRATE

机译:制造复合结构的方法,包括在SiC支撑基板上的薄SiC单帧SiC层

摘要

The invention relates to a method of manufacturing a composite structure comprising a thin film of monocrystalline silicon carbide disposed on a support substrate of silicon carbide, the method comprising: a) a step of providing a donor substrate made of carbon carbide. monocrystalline silicon, b) a step of ionic implantation of light species in the donor substrate, to form a buried brittle plane delimiting the thin layer between said buried brittle plane and a free surface of said donor substrate, c) a succession of n steps forming crystallized support layers, with n greater than or equal to 2; the n crystallized support layers being arranged on the front face of the donor substrate successively on top of each other, and forming the support substrate; each forming step comprising: - chemical vapor deposition assisted by direct liquid injection, at a temperature below 900 ° C, to form a support layer, said support layer being formed by an at least partially amorphous SiC matrix, and having a thickness less than or equal to 200 microns; - a heat treatment of crystallization of the support layer, at a temperature less than or equal to 1000 ° C, to form a crystallized support layer, d) a separation step along the buried fragile plane, to form on the one hand a structure composite comprising the thin layer on the support substrate, and on the other hand the remainder of the donor substrate. Figure to be published with the abstract: No figure
机译:本发明涉及一种制造复合结构的方法,该复合结构包括设置在碳化硅的支撑基板上的单晶硅碳化物的薄膜,该方法包括:a)提供由碳化碳制成的供体基板的步骤。单晶硅硅,b)在供体基材中的光物质离子植入的步骤,以形成掩埋脆性平面,将薄层界定在所述掩埋脆性平面和所述供体基材的自由表面之间的薄层,C)连续形成n个步骤结晶的支撑层,n大于或等于2; n结晶支撑层连续地布置在供体基板的前面,彼此顶部,并形成支撑基板;包括: - 通过直接液体注入的化学气相沉积,在低于900℃的温度下辅助,以形成支撑层,所述支撑层由至少部分非晶的SiC基质形成,并且厚度小于或厚度等于200微米; - 将支撑层结晶的热处理,在小于或等于1000℃的温度下,形成结晶的支撑层,d)沿着掩埋易碎平面的分离步骤,以形成一方面的结构复合材料包括在支撑基板上的薄层,另一方面,在另一方面施主基板的其余部分。图与摘要发布:没有数字

著录项

  • 公开/公告号FR3108774A1

    专利类型

  • 公开/公告日2021-10-01

    原文格式PDF

  • 申请/专利权人 SOITEC;

    申请/专利号FR2003024

  • 发明设计人 HUGO BIARD;

    申请日2020-03-27

  • 分类号H01L21/02;H01L21/265;H01L21/306;H01L21/324;

  • 国家 FR

  • 入库时间 2022-08-24 21:25:32

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