首页> 外国专利> PROCESS FOR MANUFACTURING A COMPOSITE STRUCTURE INCLUDING A THIN SIC MONOCRISTALLINE SIC LAYER ON A SIC SUPPORT SUBSTRATE

PROCESS FOR MANUFACTURING A COMPOSITE STRUCTURE INCLUDING A THIN SIC MONOCRISTALLINE SIC LAYER ON A SIC SUPPORT SUBSTRATE

机译:制造复合结构的方法,包括在SiC支撑基板上的薄SiC单帧SiC层

摘要

The invention relates to a method of manufacturing a composite structure comprising a thin film of monocrystalline silicon carbide disposed on a support substrate of silicon carbide, the method comprising: a) a step of providing a donor substrate of monocrystalline SiC , the donor substrate comprising a donor layer produced by epitaxial growth on an initial substrate, the donor layer having a density of crystalline defects lower than that of the initial substrate, b) a step of ionic implantation of light species in the donor layer, to form a buried brittle plane delimiting the thin layer between said buried brittle plane and a free face of said donor layer, c) a succession of n stages of forming support layers, with n greater than or equal to 2; the n support layers being arranged on the donor layer successively one on top of the other, and forming the support substrate; each forming step comprising a chemical vapor deposition, at a temperature between 400 ° C and 1100 ° C, to form a support layer of polycrystalline SiC; the n chemical vapor deposition being carried out at n different temperatures, d) a separation step along the buried fragile plane, to form on the one hand a composite structure comprising the thin layer on the support substrate, and on the other hand the rest of the donor substrate, e) a mechanical and / or chemical treatment step (s) of the composite structure. Figure to be published with the abstract: No figure
机译:本发明涉及一种制造复合结构的方法,该复合结构包括设置在碳化硅的支撑基板上的单晶硅碳化硅的薄膜,该方法包括:a)提供单晶SiC的供体基材的步骤,包括a)通过外延生长产生的供体层,初始衬底的密度低于初始基板的缺陷密度,b)在供体层中的光物质的离子植入步骤,形成掩埋脆性平面限定所述掩埋脆性平面和所述供体层的自由面之间的薄层,C)形成支撑层的氮阶段,n大于或等于2; N个支撑层连续地布置在另一个上的供体层上,形成支撑基板;每个形成步骤,包括化学气相沉积,在400℃和1100℃的温度下,形成多晶SiC的支撑层; n化学气相沉积在n个不同的温度下进行,d)沿着掩埋易碎平面的分离步骤,在一方面形成包括在支撑基板上的薄层的复合结构,另一方面供体基材,e)复合结构的机械和/或化学处理步骤。图与摘要发布:没有数字

著录项

  • 公开/公告号FR3108775A1

    专利类型

  • 公开/公告日2021-10-01

    原文格式PDF

  • 申请/专利权人 SOITEC;

    申请/专利号FR2003026

  • 发明设计人 HUGO BIARD;IONUT RADU;DIDIER LANDRU;

    申请日2020-03-27

  • 分类号H01L21/02;H01L21/265;H01L21/306;H01L21/324;

  • 国家 FR

  • 入库时间 2022-08-24 21:25:32

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