SOLDER RESIST INK COMPOSITION AND FORMATION METHOD OF RESIST PATTERN

摘要

PURPOSE: To obtain a composition wherein it can obtain a solder resist film whose various characteristics such as a solder heat-resistant property, an electrical insulating property, an electric corrosion-resistant property, a chemical-resistant property, a close contact property and the like are excellent, it is excellent in characteristics such as a finger touch property after a temporarily drying operation, a developing property, a photoreactive property, a pot life and the like, it is excellent regarding an environmental problem and a fire danager, it can be diluted with water and it is excellent in a photoreactive property and a thermoset property. ;CONSTITUTION: A tertiary amine compound which is provided with an ethylene-related unsaturated bond, a photopolymerization initiator, a diluent and an epoxy resin are contained in one molecule. The tertiary amine compound is used after it has been neutralized by means of a carboxyl acid, and the addition amount of the epoxy resin is 2 to 15 times of the equivalent of the carboxylic acid used for a neutralization operation. A printed wiring board is coated with a resist ink composition; after that, the composition is dried temporarily and made hydrophobic; it is exposed by using an active beam of light; it is developed by means of a dilute-acid aqueous solution. A pattern is formed; after that, it is heated and thermally hardened. A solder-resist pattern is formed.;COPYRIGHT: (C)1993,JPO&Japio