Contact structure in probe card, has projection made of electrically conducting material provided in contact board to connect contact pad that is in electrical communication with PCB, via contact trace in via hole

摘要

A projection (30) made up of electrically conductive material attached to a contact board (20), is in contact with a conductive pad (36) that is formed at back side of the contact board to contact a printed circuit board (62) through an electroconductive bump (56). The projection (30) contacts the conductive pad (36) through a trace provided in via hole (35) formed at contact board.