首页> 外国专利> COMPOSITION FOR FORMING PLATING LAYER, FILM HAVING PLATING LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATING LAYER, ELECTRICALLY CONDUCTIVE FILM, AND TOUCH PANEL

COMPOSITION FOR FORMING PLATING LAYER, FILM HAVING PLATING LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATING LAYER, ELECTRICALLY CONDUCTIVE FILM, AND TOUCH PANEL

机译:用于形成镀层,膜具有镀层前体层,膜具有图案化镀层,导电膜和触控面板的组合物

摘要

The present invention provides: a composition for forming a plating layer, which can form a metal layer having excellent electrical conductivity by means of plating treatment and which can form a plating layer having excellent adhesion to the metal layer; a film having a plating layer precursor layer, which is obtained using the composition for forming a plating layer; a film having a plating layer; an electrically conductive film; and a touch panel. This composition for forming a plating layer contains a non-polymerizable polymer having groups that interact with metal ions, a polyfunctional monomer having two or more polymerizable functional groups, a monofunctional monomer, and a polymerization initiator.
机译:本发明提供了一种镀层形成用组合物,其可以通过镀覆处理形成导电性优异的金属层,并且可以形成与金属层的密合性优异的镀层。使用镀层形成用组合物得到的具有镀层前体层的膜。具有镀层的膜;导电膜;和触摸屏。用于形成镀层的该组合物包含具有与金属离子相互作用的基团的不可聚合的聚合物,具有两个以上可聚合的官能团的多官能单体,单官能单体和聚合引发剂。

著录项

  • 公开/公告号WO2016159136A1

    专利类型

  • 公开/公告日2016-10-06

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORPORATION;

    申请/专利号WO2016JP60486

  • 发明设计人 ICHIKI TAKAHIKO;

    申请日2016-03-30

  • 分类号C23C18/18;B32B15/08;C08F2/44;C08F220/56;C25D5/56;C25D7;H05K3/18;

  • 国家 WO

  • 入库时间 2022-08-21 14:16:17

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