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COMPOSITION FOR FORMING PLATING LAYER, FILM HAVING PLATING LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATING LAYER, CONDUCTIVE FILM, AND TOUCH PANEL
COMPOSITION FOR FORMING PLATING LAYER, FILM HAVING PLATING LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATING LAYER, CONDUCTIVE FILM, AND TOUCH PANEL
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机译:用于形成镀层,膜具有镀层前体层,膜具有图案化镀层,导电膜和触控面板的组合物
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摘要
Provided are a composition for forming a plating layer, which is capable of forming a metal layer having excellent conductivity by means of a plating treatment and is capable of forming a plating layer having excellent adhesiveness to the metal layer, as well as a film having a plating layer precursor layer, a film having a plating layer, a conductive film, and a touch panel, each of which uses the composition for forming a plating layer.;The composition for forming a plating layer according to the present invention includes a non-polymerizable polymer having a group capable of interacting with a metal ion, a polyfunctional monomer having two or more polymerizable functional groups, a monofunctional monomer, and a polymerization initiator.
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