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Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry
Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry
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机译:用于防止由有源电路封装的MEMS器件的粘连的装置和方法
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摘要
One or more stopper features (e.g., bump structures) are formed in a standard ASIC wafer top passivation layer for preventing MEMS device stiction vertically in integrated devices having a MEMS device capped directly by an ASIC wafer. A TiN coating may be used on the stopper feature(s) for anti-stiction. An electrical potential may be applied to the TiN anti-stiction coating of one or more stopper features.
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