THERMAL CHARACTERIZATION MEASUREMENT DEVICE AND THERMAL CHARACTERIZATION MEASUREMENT METHOD USING SAME

摘要

Provided is a highly reliable thermal characterization measurement device that can measure the heat contact resistance value, heat resistance value, and heat conductivity of an object to be measured using a unidirectional heat-flux static comparison method, and that can be applied to suitable heat measurement analysis technology using the surface pressure dependency of the object to be measured, a heat contact method, and a heat-transfer promoting effect.　In a thermal characterization measurement device 1, the following are sequentially stacked: a heat generating source unit 4 that has heat sensors 4g₁, 4g₂ for detecting heat radiating toward a measurement sample unit 5, and that heats the measurement sample unit 5; the measurement sample unit 5; and a heat cooling source unit 6 that has heat sensors 6c₁, 6c₂ for detecting heat radiating from the measurement sample unit 5, and that cools the measurement sample unit 5. The measurement sample unit 5 has a three-layer structure consisting of an object 5b to be subjected to thermal characterization measurement, and heat conducting materials 5a, 5c that sandwich said object 5b. The heat conducting materials 5a, 5c, the heat generating source unit 4, and the heat cooling source unit 6 are adhered to one another with a heat-transfer promoting agent therebetween. The object 5b to be subjected to thermal characterization measurement and the heat conducting materials 5a, 5c are adhered to one another by physical contact, chemical contact, and/or chemical bond contact.